The redispersion factor of microbe-carrying particles, which is the ratio of the concentration of floor-derived microbes in room air to those on a floor surface, was determined, as was the percentage of floor-derived microbes in room air. These relationships were shown to vary according to conditions in the room. Equations were derived that allow these relationships to be calculated for a variety of room conditions, including air supply rates, levels of personnel activity, and the effect of gravitational deposition on microbe-carrying particles.
Sys tem atic eval u a tions of con cept de signs in volve con sid er ing a range of cri te ria. In ter ac tion with in dus try sup ports the view that re li abil ity is a ma jor cri te rion among those con sid ered in prod uct de sign. Al though there are few meth ods to pre dict re li abil ity in the ini tial phases of de sign, most of them are only ap pli ca ble to adap tive de signs. In this pa per, we in tro duce the con cept of rel a tive re li abil ity risk as sess ment for orig i nal de signs, where in for ma tion avail abil ity is less, to cal cu late re li abil ity. We con sider the func tion struc tures of the prod uct un der con sid er ation and ap ply the an a lytic hi er ar chy pro cess us ing ver bal as sess ments for rel a tive mea sure ments. The weight as sign ing tech nique used is the en tropy method. a fi nal value of R 3 I (Rel a tive Re li abil ity Risk In dex) is cal cu lated and the idea of con cept func tion al ity graphs is pre sented. This method is ap plied on the ex am ple of seat sus pen sions for an off high way ve hi cle and the re sults are dis cussed. The find ings help to sort out the con cepts that are rel a tively strong in terms of re li abil ity.
There is growing interest in the development of fabrication techniques to cost effectively mass-produced high-resolution (micro/nano) three-dimensional structures in a range of materials. Biomedical applications are particularly significant. This work demonstrates how to fabricate simultaneously a sacrificial mould having the inverse shape of the desired device structure and also create the desired device structure using electrodeposition techniques. The mould is constructed of many thin layers using a photo-resist material that is dissolvable and sensitive to ultraviolet (UV) light. At the same time the device is created in the emerging mould layers using gold electrodeposition technique. Choosing to fabricate the mould and the three-dimensional structures in multiple thin layers allows for the use of UV light and permits the potential cost-effective realization of three-dimensional curved surfaces, the accuracy and geometric details of which are related to the number of layers used. An example is provided to explain the novel fabrication process and to outline the resulting design and fabrication constraints.
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