Molecular dynamics simulation on crystal defects of single-crystal silicon during elliptical vibration cutting

Liu, Changlin; To, Suet; Sheng, Xuexiang; Xu, Jianfeng

doi:10.1016/j.ijmecsci.2022.108072

Cited by 24 publications

(6 citation statements)

References 73 publications

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“…The cutting edge forms a multi-dimensional path in the Z-X plane during every vibration cycle. The following equations, as described in earlier works [59][60][61][62][63], can be used to calculate the tool's trajectories with multi-dimensional vibration motion:…”

Section: Methodologiesmentioning

confidence: 99%

Mechanics of AlCuNiTi alloy orthogonal micro-cutting

Nguyen,

Fang

2023

Modelling Simul. Mater. Sci. Eng.

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The mechanical behavior of AlCuNiTi alloy during orthogonal micro-cutting consists of conventional cutting and complex-dimensional vibration cutting (CDVC) are investigated using molecular dynamics (MD). The material removal mechanism is studied in terms of phase angle, amplitude ratio, and vibration frequency. In both techniques, the stress and strain are localized in the contiguous location between the sample and the cutting tool. The sample temperature during CDVC is noticeably greater than during classical cutting, which might benefit the transition phase and make CDVC smoother. The total mean value cutting force of the CDVC decreases as the frequencies of vibration and ratios of amplitude increase; however, the mean values of force under the CDVC with different phase angles demonstrate hardly ever statistically significant change. The quantity of atoms in the chip indicates that the machined surface rate is higher under the CDVC, with a higher frequency of vibration, smaller phase angle, and amplitude ratio. Under CDVC, the chip of plastic deformation gets more pronounced and severe with a frequency of oscillation at 150 GHz, an amplitude at 1.5, and a phase angle degree of 75○ due to the lowest cutting ratio.

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Section: Methodologiesmentioning

confidence: 99%

Mechanics of AlCuNiTi alloy orthogonal micro-cutting

Nguyen,

Fang

2023

Modelling Simul. Mater. Sci. Eng.

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“…One aspect is the material parameters associated with the microstructure evolution. Previous MD simulations for diamond cutting of hard brittle materials demonstrate that the machined surface integrity strongly depends on the microstructural characteristics of material, including cutting orientation, machined surface orientation and grain size, etc [113][114][115][116]. For instance, the ductile machinability of single crystal 6H-SiC under different cutting orientations at a DOC of 2 nm is investigated.…”

Section: Ductile Machinability Of Hard Brittle Materialsmentioning

confidence: 99%

Numerical simulation of materials-oriented ultra-precision diamond cutting: review and outlook

Zhao

Zhang

et al. 2023

Int. J. Extrem. Manuf.

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Ultra-precision diamond cutting is a promising machining technique for realizing ultra-smooth surface of different kinds of materials. While fundamental understanding of the impact of workpiece material properties on cutting mechanisms is crucial for promoting the capability of the machining technique, numerical simulation methods at different length and time scales act as important supplements to experimental investigations. In this work, we present a compact review on recent advancements in the numerical simulations of material-oriented diamond cutting, in which representative machining phenomena are systematically summarized and discussed by multiscale simulations such as molecular dynamics simulation and finite element simulation: the anisotropy cutting behavior of polycrystalline material, the thermos-mechanical coupling tool-chip friction states, the synergetic cutting responses of individual phase in composite materials, and the impact of various external energetic fields on cutting processes. In particular, the novel physics-based numerical models, which involve the high precision constitutive law associated with heterogeneous deformation behavior, the thermo-mechanical coupling algorithm associated with tool-chip friction, the configurations of individual phases in line with real microstructural characteristics of composite materials, and the integration of external energetic fields into cutting models, are highlighted. Finally, insights into the future development of advanced numerical simulation techniques for diamond cutting of advanced structured materials are also provided. The aspects reported in this review present guidelines for the numerical simulations of ultra-precision mechanical machining responses for a variety of materials.

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“…By comparing the stress distributions at three specified strain rates under the same applied strain in Figure 5b, it is observed that the peak position (average stress) varies. Based on previous research on nanoscratching and nanoidentation models, Liu [88] proposed and developed an innovative MD model for DWS. An MD simulation was performed to analyze the diamond wire cutting process on a monocrystalline silicon workpiece using a tool grain with a radius of 2.142 nm.…”

Section: Molecular Dynamics Modelmentioning

confidence: 99%

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Zhou³

et al. 2023

Micromachines

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Due to the brittleness of silicon, the use of a diamond wire to cut silicon wafers is a critical stage in solar cell manufacturing. In order to improve the production yield of the cutting process, it is necessary to have a thorough understanding of the phenomena relating to the cutting parameters. This research reviews and summarizes the technology for the precision machining of monocrystalline silicon using diamond wire sawing (DWS). Firstly, mathematical models, molecular dynamics (MD), the finite element method (FEM), and other methods used for studying the principle of DWS are compared. Secondly, the equipment used for DWS is reviewed, the influences of the direction and magnitude of the cutting force on the material removal rate (MRR) are analyzed, and the improvement of silicon wafer surface quality through optimizing process parameters is summarized. Thirdly, the principles and processing performances of three assisted machining methods, namely ultrasonic vibration-assisted DWS (UV-DWS), electrical discharge vibration-assisted DWS (ED-DWS), and electrochemical-assisted DWS (EC-DWS), are reviewed separately. Finally, the prospects for the precision machining of monocrystalline silicon using DWS are provided, highlighting its significant potential for future development and improvement.

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Molecular dynamics simulation on crystal defects of single-crystal silicon during elliptical vibration cutting

Cited by 24 publications

References 73 publications

Mechanics of AlCuNiTi alloy orthogonal micro-cutting

Mechanics of AlCuNiTi alloy orthogonal micro-cutting

Numerical simulation of materials-oriented ultra-precision diamond cutting: review and outlook

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

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