Mechanics of AlCuNiTi alloy orthogonal micro-cutting

Abstract

The mechanical behavior of AlCuNiTi alloy during orthogonal micro-cutting consists of conventional cutting and complex-dimensional vibration cutting (CDVC) are investigated using molecular dynamics (MD). The material removal mechanism is studied in terms of phase angle, amplitude ratio, and vibration frequency. In both techniques, the stress and strain are localized in the contiguous location between the sample and the cutting tool. The sample temperature during CDVC is noticeably greater than during classical cutting, which might benefit the transition phase and make CDVC smoother. The total mean value cutting force of the CDVC decreases as the frequencies of vibration and ratios of amplitude increase; however, the mean values of force under the CDVC with different phase angles demonstrate hardly ever statistically significant change. The quantity of atoms in the chip indicates that the machined surface rate is higher under the CDVC, with a higher frequency of vibration, smaller phase angle, and amplitude ratio. Under CDVC, the chip of plastic deformation gets more pronounced and severe with a frequency of oscillation at 150 GHz, an amplitude at 1.5, and a phase angle degree of 75○ due to the lowest cutting ratio.

Material deformation mechanism of lamellar twined high–entropy alloys during machining

“…Additionally, the fluctuation value can be reflected in the stableness of the machining process. The lower the variation value, the more steady the cutting force, resulting in bettermachined surface quality [48]. The average cutting force and force fluctuation of HEA with different twin spacing are shown in figure 7(a).…”

“…Besides, the pile-up side flow thickness reflects the machined surface quality. The larger the pile-up side flow width, the poorer the machined surface quality [48]. The pile-up side flow width (indicated in a black rectangle) gets a high width value as the TBS = 6a to 8a.…”

Study on copper-to-copper bonding of three-dimensional integrated circuits using the quasicontinuum method

“…With commercially accessible bonding equipment, Cu-Cu bonding with a temperature gradient in ambient settings can meet the industry requirement for heterogeneous chip integration [4,16]. The quasi-continuous method has diverse applications, including nanoimprinting [17][18][19][20][21][22], nanocutting [23,24], nanomilling [25], grinding [26], nanowelding [27][28][29], bending and punching [30], cyclic loading [31,32], nanoindentation [33][34][35][36][37][38], rough surfaces [39], interface fracture [40], crack growth characteristics [41], and plastic deformation [42,43] processes, enabling the analysis of plastic deformation and internal mechanical responses occurring within a material subjected to the influence of an indenter involves a comprehensive analysis. This analysis delves into the intricate processes occurring within the material as it undergoes deformation, elucidating the internal mechanisms at play.…”