Numerical simulation of materials-oriented ultra-precision diamond cutting: review and outlook

Abstract

Ultra-precision diamond cutting is a promising machining technique for realizing ultra-smooth surface of different kinds of materials. While fundamental understanding of the impact of workpiece material properties on cutting mechanisms is crucial for promoting the capability of the machining technique, numerical simulation methods at different length and time scales act as important supplements to experimental investigations. In this work, we present a compact review on recent advancements in the numerical simulations of material-oriented diamond cutting, in which representative machining phenomena are systematically summarized and discussed by multiscale simulations such as molecular dynamics simulation and finite element simulation: the anisotropy cutting behavior of polycrystalline material, the thermos-mechanical coupling tool-chip friction states, the synergetic cutting responses of individual phase in composite materials, and the impact of various external energetic fields on cutting processes. In particular, the novel physics-based numerical models, which involve the high precision constitutive law associated with heterogeneous deformation behavior, the thermo-mechanical coupling algorithm associated with tool-chip friction, the configurations of individual phases in line with real microstructural characteristics of composite materials, and the integration of external energetic fields into cutting models, are highlighted. Finally, insights into the future development of advanced numerical simulation techniques for diamond cutting of advanced structured materials are also provided. The aspects reported in this review present guidelines for the numerical simulations of ultra-precision mechanical machining responses for a variety of materials.

Optimization of Surface Roughness of Aluminium RSA 443 in Diamond Tool Turning

“…Hence, the microstructures of a piece of RSA material are both complex in terms of the grain structures, and inhomogeneous through the section. The microstructural configuration at the point of machining potentially has anisotropy mechanical properties [28]. It is to be expected that this will affect the cutting behavior by changing the tool-cutting dynamics (including chip formation) and hence affect the surface roughness.…”

“…It is to be expected that this will affect the cutting behavior by changing the tool-cutting dynamics (including chip formation) and hence affect the surface roughness. However, this complex interaction is only beginning to be explored; for a review of simulation of the effect on lattice deformation and crack propagation (at the atomic scale) on chip formation, see [28].…”

“…However the anisotropic nature of RSA materials is a challenge because it affects surface roughness in ways that are difficult to predict [21]. To some extent, this is being addressed by molecular dynamic simulations [28]; however, this technique is limited to small ensembles of atoms, often in a single plane, which is not truly representative of three-dimensional geometry.…”

Finite element simulation and experimental investigation of in-situ laser-assisted diamond turning of monocrystalline silicon

“…This is because the hardness value of 13-14 GPa of monocrystalline silicon changes slightly within the temperature range between 300 K-600 K. Consequently, the cutting force in a temperature filed of 600 K is only reduced by 11.9% compared to that of CT at 300 K. However, as the temperature exceeds 600 K, the hardness of monocrystalline silicon decreases sharply to 3 GPa at 900 K [1,31], resulting into a 39.0% reduction in cutting force compared to that of CT. Therefore, to achieve a high machined surface quality of monocrystalline silicon and simultaneously suppress tool wear, the suitable temperature for In-LAT is approximately 900 K. The findings provide not only valuable insights into the cutting mechanisms of hard brittle materials under In-LAT, but also optimization methodology of processing parameters for In-LAT application [32]. assistance results into a dispersed and reduced stress distribution in cutting zone, which is contrast to the concentrated stress at the rake face and cutting edge in CT.…”

A Novel Approach to Optimizing Grinding Parameters in the Parallel Grinding Process

“…The high hardness makes them difficult to machine [4]. Diamond cutting processes, including diamond turning and milling, are normally applied to machine soft materials and can reliably achieve high accuracy and good surface integrity [5][6][7]. By contrast, severe tool wear will occur and result in poor surface quality during diamond cutting of hard materials [8,9].…”