Modified microscale pattern transfer without photolithography of substrates

Qu, Ningsong; Zhang, X.F.; Chen, X.L.; Li, H.S.; Zhu, Daiyin

doi:10.1016/j.jmatprotec.2014.11.040

Cited by 26 publications

(13 citation statements)

References 13 publications

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“…It was further discovered from Figure 14 that the minimum CV depth and CV diameter are 5.4% and 1.9%, respectively, when the appropriate combination of the applied voltage (8.5 V) and the moving speed (0.5 m/s) are used, showing a considerably narrower variation range of 43.7-51.3 µm in depth and 370.9-394.9 µm in diameter. To the best knowledge of the authors from the reported literature, the CV values obtained in our study are sufficiently small to reach the levels that were obtained from the standard photolithographic photoresist electrochemical machining process [20,21,28], and they are also smaller than those achieved with the first version foamed cathode TMEMM process [30].…”

Section: Effect Of the Applied Voltages And The Moving Speed Of The Mmentioning

confidence: 43%

Through-Mask Electrochemical Micromachining with Reciprocating Foamed Cathode

et al. 2020

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A through-mask electrochemical micromachining process with a foamed cathode (foamed-cathode through-mask electrochemical micromachining (TMEMM)) has recently been proposed involving micro-scale surface microstructures with a high geometric consistency that are fabricated on the curved-surface workpiece. In this paper, to make the foamed-cathode TMEMM process more cost-efficient in the applications, significant modifications are made to this process and an upgraded version of the foamed-cathode TMEMM process is developed. In this modified process, the sandwich-like unit (including the foamed cathode, mask, and workpiece) is closely assembled by the magnetic field force instead of the conventionally-used mechanical force and is kept moving up-and-down inside the electrolyte, avoiding the use of the traditional pump-driven circulation for the electrode process. Experiments are carried out to evaluate the machining effect of this modified TMEMM for fabricating micro-dimples. The research results verify that this modified TMEMM process can produce highly uniform micro-dimples whose minimum CV (coefficient of variation) values in depth and in diameter are 5.4% and 1.9%, respectively, with smooth surfaces of the minimum Ra being 0.21-0.35 µm. These values are smaller than those previously reported. This results in the positive effects on the mass transfer driven by magnetohydrodynamic convection induced by the magnetic field within the interelectrode and the foamed electrode.Micromachines 2020, 11, 188 2 of 14 is very tedious and expensive. In addition, the photoresist through-mask cannot be well formed on the curved surface; as a result, the traditional TMEMM process is somewhat limited in industrial applications. Consequently, effort has been made to facilitate the preparation of the through-mask by researchers. For instance, Landolt et al. and Chauvy et al. [13,14] employed patterned oxide film as the through-mask to texturize titanium. Asoh et al. [15] presented a novel TMEMM process to accomplish the formation of large-scale microstructures just by using the self-assembled polystyrene colloidal crystal particles as the through-mask. In an unusual way, Schönenberger et al. [16] and Costa et al. [17,18] bonded the through-mask to the cathode surface instead of the workpiece surface (anode) to carry out the micro-pattern transferring operation. Recently, further optimized the preparation of the through-mask of this kind of cathode-typed TMEMM by using the removable dry film through-mask, resulting in high cost-effectiveness.Unlike the conventional TMEMM processes using the bonded through-mask, a removable and reusable through-mask electrochemical machining process was exploited by Zhu et al. [22][23][24]. In this novel process, the mask is pressed mechanically against the workpiece, and thus, it can be reused repeatedly, showing a favorable operational convenience and cost-effective superiority. Additionally, in this novel process, Qu et al. [25][26][27][28] used polydimethylsiloxane (PDMS) film as the reusable mask d...

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Section: Effect Of the Applied Voltages And The Moving Speed Of The Mmentioning

confidence: 43%

Through-Mask Electrochemical Micromachining with Reciprocating Foamed Cathode

et al. 2020

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“…It consists of electrodes, an electrolyte circulating system, a power supply, and a control unit. The electrolyte is injected into the work tank by employing a pressure pump and the electrolyte flows into the through-holes in the dry-film mask [17]. GPM220 dry-film (DuPont, USA), a negative photoresist, is employed, which exhibits adhesiveness, inherent planarization, and good flexibility.…”

Section: Methodsmentioning

confidence: 99%

“…SLEMM resembles the EMM technique proposed by Qu et al [17]: modified microscale pattern transfer without photolithography of substrates. In both of these methods, the current density distribution is enhanced, which helps to achieve a high machining accuracy.…”

Section: Introductionmentioning

confidence: 99%

Sandwich-like electrochemical micromachining of micro-dimples

Zhang

Chen

2016

Surface and Coatings Technology

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“…7 [20]. It consists of electrodes, electrolyte circulating system, power supply, sensors, and control unit.…”

Section: Methodsmentioning

confidence: 99%

“…A novel EMM technique, involving modified microscale pattern transfer without photolithography of substrates, has been proposed by Qu et al [20] for the production of microdimple arrays with improved machining accuracy. However, the influence of machining parameters on the machining accuracy of the micro-dimples produced by this method has so Electrolytic conductivity κ (S/m) 10 Diameter of the through-holes in the dry-film mask D 0 (μm) 100 Thickness of the dry-film mask H 0 (μm) 50…”

Section: Introductionmentioning

confidence: 99%

Investigation of machining accuracy of micro-dimples fabricated by modified microscale pattern transfer without photolithography of substrates

Zhang

et al. 2015

Int J Adv Manuf Technol

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Micro-dimples are among the basic microfeatures that have been applied to different products in various fields. The product performance and service life of textured surfaces are directly affected by size, location, and density. A modified microscale pattern transfer process without photolithography of substrates, through the use of movable dry-film mask electrochemical micromachining, has been proposed for the production of micro-dimples. This paper investigates the influence of electrochemical micromachining parameters, namely, applied voltage and machining time on the machining accuracy of micro-dimples produced using this technique. Experimental results indicate that the machining accuracy deteriorates with prolonged machining time and increasing applied voltage. It is found that to obtain high machining accuracy when machining micro-dimples of similar depth, a combination of higher current density with reduced machining time is recommended.

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Modified microscale pattern transfer without photolithography of substrates

Cited by 26 publications

References 13 publications

Through-Mask Electrochemical Micromachining with Reciprocating Foamed Cathode

Through-Mask Electrochemical Micromachining with Reciprocating Foamed Cathode

Sandwich-like electrochemical micromachining of micro-dimples

Investigation of machining accuracy of micro-dimples fabricated by modified microscale pattern transfer without photolithography of substrates

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