2016
DOI: 10.1016/j.surfcoat.2016.05.088
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Sandwich-like electrochemical micromachining of micro-dimples

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Cited by 49 publications
(15 citation statements)
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“…It was further discovered from Figure.14 that the minimum CV depth and CV diameter are 5.4% and 1.9%, respectively, when the appropriate combination of the applied voltage (8.5 V) and the moving speed (0.5 m/s) are used, showing a considerably narrower variation range of 43.7-51.3 μm in depth and 370.9-394.9 μm in diameter. To the best knowledge of the authors from the reported literature, the CV values obtained in our study are sufficiently small to reach the levels that were obtained from the standard photolithographic photoresist electrochemical machining process [20,21,28], and they are also smaller than those achieved with the first version foamed cathode TMEMM process [30].…”
Section: Effect Of the Applied Voltages And The Moving Speed Of The Mmentioning
confidence: 44%
“…It was further discovered from Figure.14 that the minimum CV depth and CV diameter are 5.4% and 1.9%, respectively, when the appropriate combination of the applied voltage (8.5 V) and the moving speed (0.5 m/s) are used, showing a considerably narrower variation range of 43.7-51.3 μm in depth and 370.9-394.9 μm in diameter. To the best knowledge of the authors from the reported literature, the CV values obtained in our study are sufficiently small to reach the levels that were obtained from the standard photolithographic photoresist electrochemical machining process [20,21,28], and they are also smaller than those achieved with the first version foamed cathode TMEMM process [30].…”
Section: Effect Of the Applied Voltages And The Moving Speed Of The Mmentioning
confidence: 44%
“…It is worth pointing out that ECPTM also suffers from severe stray corrosion on both sides of the micro-groove due to the unprotected surface of the workpiece. Zhang et al [24] developed a sandwich-like electrochemical micromachining (SLEMM) technology for reducing overcut and improving the dimensional uniformity of micro-dimples by enabling uniform distribution of the electric field in the machining region. However, the generation of bubbles and accumulation of insoluble products in the machining region suppress the dissolution of the workpiece.…”
Section: Instructionmentioning
confidence: 99%
“…Many of the studies recently focus on producing micro dimple array instead of single dimple [62]. Many technics have emerged such as maskless electrochemical texturing (MECT) [60,63], through-mask electrochemical micromachining (TMEMM) [58,62,[64][65][66][67], using Polydimethylsiloxane (PDMS) mask [59,61,[68][69][70][71], sandwich-like electrochemical micromachining (SLEMM) [72][73] and others [74]. Chen et al [69] had applied the ECM method with TMEMM technic together with a PDMS mask and successfully produce micro dimple array on a cylindrical surface.…”
Section: Electrochemical Machining (Ecm) and Electrical Discharge Machimentioning
confidence: 99%