2014
DOI: 10.1088/1742-6596/494/1/012019
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Modelling of MOCVD Reactor: New 3D Approach

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Cited by 10 publications
(7 citation statements)
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“…We address the gradient in emission along the m‐plane sidewall to a gradual local change of InGaN growth conditions with distance from the masked substrate, leading to an inhomogeneous incorporation of Indium resulting in different emission wavelengths and intensities . According to recent modelling, the temperature gradient along the height of such structures is expected not to exceed a few degrees and thus it will not significantly affect the growth. Another possible origin might be due to diffusion effects in the gas phase and probably also on the sample's surface.…”
Section: Resultsmentioning
confidence: 99%
“…We address the gradient in emission along the m‐plane sidewall to a gradual local change of InGaN growth conditions with distance from the masked substrate, leading to an inhomogeneous incorporation of Indium resulting in different emission wavelengths and intensities . According to recent modelling, the temperature gradient along the height of such structures is expected not to exceed a few degrees and thus it will not significantly affect the growth. Another possible origin might be due to diffusion effects in the gas phase and probably also on the sample's surface.…”
Section: Resultsmentioning
confidence: 99%
“…Based on our experience [17,35] in MOVPE reactor analysis, a suitable reactor model was prepared. For the numerical investigations presented in the study, ANSYS Fluent was used [36].…”
Section: Reaction-transport Modelmentioning
confidence: 99%
“…Furthermore, the temperature measurements in the reactor chamber are limited due to the restricted access and the expected range (e.g., 600 • C to 1200 • C in the case of GaN). As a consequence, numerical simulations of the process [14][15][16][17][18] are necessary to predict and investigate the growth conditions, and to improve the epitaxy process.…”
Section: Introductionmentioning
confidence: 99%
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“…It is worth noting that although CAD tools are commonly used in microelectronics technology to support the design of devices [25], their manufacturing processes [26][27][28][29] or the investigation of semiconductor features [30], their use as an element of measuring set-up that controls the technology process is presented here, probably for the first time. This paper presents the construction details of the Degussa furnace reactor with an additional cassette for SiC processing, which was the starting point for the creation of a numerical model of the phenomena occurring in the reactor during high-temperature processes, as well as the subsequent stages of CAD model development and verification of taken assumptions.…”
Section: Introductionmentioning
confidence: 99%