Modelling mutual thermal coupling in LED modules

Górecki, Krzysztof; Ptak, Przemysław

doi:10.1108/mi-01-2015-0013

Cited by 17 publications

(12 citation statements)

References 20 publications

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“…The dependence of the output voltage on the RMS value of the input voltage V out (V 1 ) presented in Figure was obtained when the load of the considered power supply was a LED module contained in the lamp CLA25. The model of this module is described in Górecki and Ptak …”

Section: Investigation Resultsmentioning

confidence: 99%

Modeling power supplies of LED lamps

Górecki

Ptak

2017

Circuit Theory & Apps

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Summary In the paper, the model of the power supply of the LED lamp in the form dedicated for SPICE is proposed. The form of the worked out by the authors' model is presented, and the results of experimental verification of this model for the LED lamp of the type CLA25 are shown. The presented model is elaborated only for the power supply of LED lamps, in which the constant output voltage is stabilized. This model has the form of a subcircuit for SPICE, and it describes the influence of load resistance, amplitude of the input voltage, and the ambient temperature on both the input current and the output voltage. It is confirmed that the worked out model describes correctly both the waveform of the current received from the electroenergy network and the influence of the load current, the ambient temperature, and the supply voltage on the output voltage.

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Section: Investigation Resultsmentioning

confidence: 99%

Modeling power supplies of LED lamps

Górecki

Ptak

2017

Circuit Theory & Apps

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“…The model takes into account only self-heating phenomena due to thermal power dissipated in the module. Such a method has been presented in the literature [5,9,21].…”

Section: The Model Formmentioning

confidence: 99%

“…To enable calculation of the value of internal temperature of each LED being a part of the LED module, it is indispensable to take into account the dependence of internal temperature of each diode on the power dissipated in the whole module [15,19,20]. The authors in their previous papers [5,9,16,21] proposed electro-thermo-optical models of LED modules taking into account selfheating phenomena and mutual thermal couplings, and verified them for small LED modules, whose diameter did not exceed 5 cm. In such models, temperature of the common base and internal temperatures of all diodes are used, whereas transient thermal impedances of all the diodes are the same.…”

Section: Introductionmentioning

confidence: 98%

“…LED modules can accept different shapes and they can be situated on the Metal Core Printed Circuit Board (MCPCB) base with different thicknesses of the aluminum-layer. It is justified, that large LED modules contain from several to tens LEDs in order to limit the value of feeding current [5,[8][9][10][11][12][13]. Distances between each pair of LEDs in the module do not exceed several centimeters, which causes that mutual thermal couplings between diodes situated on the same basis occur [5,14,15].…”

Section: Introductionmentioning

confidence: 99%

“…It is worth noting that temperature strongly influences characteristics, operating parameters * E-mail: k.gorecki@we.am.gdynia.pl and reliability of discrete semiconductor devices and modules, such as IGBT [17] and LED modules [5,9,18]. Therefore, the information about the value of internal temperature of semiconductor devices contained in the mentioned modules is very important.…”

Section: Introductionmentioning

confidence: 99%

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Modelling thermal properties of large LED modules

Ptak

Górecki

Dziurdzia

2019

Materials Science-Poland

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In this paper a problem of modelling thermal properties of large LED modules is considered. The compact thermal model of such modules is proposed. The form of this model is presented and a method of parameters estimation is described. The practical usefulness of this model is verified experimentally by comparing the results of calculations and measurements of internal temperature of selected LEDs included in LED modules. The modules were fabricated by Fideltronic, Poland and measurements of temperature distribution on the surface of the modules at selected variants of power dissipation were performed at the Gdynia Maritime University. Good agreement between the results of measurements and modelling was obtained.

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Modeling temperature dynamic effects for high‐power light‐emitting diodes

Kyatam

Rodrigues

Alves

et al. 2022

Circuit Theory & Apps

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Temperature is a dynamic variable in most electronic devices. As the device operates, it generates heat, which translates in a temperature increase. Available models commonly disregard these variations due to the fact that they manifest at very large time scales. However, temperature dynamic effects have profound implications on the device model and on our common understanding. This paper discusses implications of considering the temperature variations on the current-voltage characteristic curves of power light-emitting diodes. The main theoretical results establish that the current equation has a memristive nature when temperature is assumed as a dynamical state variable. This hypothesis is then validated experimentally. K E Y W O R D SDC characteristic, hysteresis, memristor, power diode, power LED, thermo-electrical diode model | INTRODUCTIONStandard thermal analysis of power electronic circuits usually assumes static temperature conditions, that is, temperature evolution is considered a very slow process when compared to the operating frequencies. Under this simplifying assumption (and assuming one can neglect the transfer of heat through radiation and convection), the thermal analysis of a given circuit follows straightforward Ohm's law-like relations, where temperature increases linearly with the dissipated power with a slope equal to the thermal resistance of the device. 1 This simple relation is the basis of conventional heat sink (HS) selection procedures, where a series of multiple thermal resistances account for the heat conduction from the device's active region, where it is generated, to the environment, where it is dissipated.Temperature is also a parameter that influences the device's characteristics. Current-voltage relations in diodes and transistors involve temperature in multiple instances: (i) the thermal voltage k B T=q (where k B is the Boltzmann constant and q is the charge of the electron) increases linearly with temperature; (ii) carrier concentrations follow Fermi-Dirac distributions, which are strongly affected by temperature; and (iii) material properties such as thermal conductivity vary with temperature. 2 These temperature-dependent device's current-voltage relations are generally oversimplified and mistreated in the available literature. For instance, it is a common procedure to depict the temperature dependence of the diode current-voltage relation as a collection of curves obtained for different fixed temperature

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Modelling mutual thermal coupling in LED modules

Cited by 17 publications

References 20 publications

Modeling power supplies of LED lamps

Modeling power supplies of LED lamps

Modelling thermal properties of large LED modules

Modeling temperature dynamic effects for high‐power light‐emitting diodes

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