Modeling power supplies of LED lamps

Abstract

Summary In the paper, the model of the power supply of the LED lamp in the form dedicated for SPICE is proposed. The form of the worked out by the authors' model is presented, and the results of experimental verification of this model for the LED lamp of the type CLA25 are shown. The presented model is elaborated only for the power supply of LED lamps, in which the constant output voltage is stabilized. This model has the form of a subcircuit for SPICE, and it describes the influence of load resistance, amplitude of the input voltage, and the ambient temperature on both the input current and the output voltage. It is confirmed that the worked out model describes correctly both the waveform of the current received from the electroenergy network and the influence of the load current, the ambient temperature, and the supply voltage on the output voltage.

A hierarchically encapsulated phase-change film with multi-stage heat management properties and conformable self-interfacing contacts for enhanced interface heat dissipation

“…[1][2][3] World-wide efforts have been made to make electronic devices and systems achieve high computing speed, increased integration densities, and smaller and thinner appearance for decades. [4][5][6] Integration upgrades lead to sharply increased power densities and internal heat uxes, which puts forward a higher demand on the timely dissipation of excess heat from hot spots to the external environment. 7,8 Thermal interface materials (TIMs) applied between heat sources and radiators with substantially higher thermal conductivity are essential components of passive heat management in various electronic devices.…”