Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication

Worgull, Matthias; Hétu, J.‐F.; Kabanemi, Kalonji K.; Heckele, M.

doi:10.1007/s00542-006-0124-0

Cited by 42 publications

(39 citation statements)

References 5 publications

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“…The Mooney-Rivlin model was simply used to study the characteristics of stress and deformation of polymer resist in the elastic range, without considering the viscoelastic and plastic effects. In this simulation, the Mooney-Rivlin model parameters, C 10 and C 01 , were included as PMMA properties considering the actual deviatoric deformation. …”

Section: Materials Propertiesmentioning

confidence: 99%

“…In respect of improving demolding technique, the reduction in defects via strengthening adhesion between the resist and the underlay was investigated experimentally by Satoshi et al [9]. Computer models and simulation tools for the hot embossing process were developed by Worgull et al [10,11]. Song et al simulated the demolding process and demonstrated influences of demolding rate and demolding angle on inner stress of the resist [12].…”

Section: Introductionmentioning

confidence: 99%

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Effects of Friction Coefficient and Cohesion between a Mold and a Polymer Resist during Demolding Process in Hot Embossing

Zhang

Wang

Zheng

et al. 2016

J. Photopol. Sci. Technol.

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Pattern fidelity in hot embossing is influenced to a large extent by defects induced with mold releasing from polymer resist. It is necessary to investigate contact properties of interface between the mold and the polymer resist during demolding process. In this paper, influences of friction coefficient and cohesion on deformation in the polymer resist during the demolding are studied via finite element method. An optimization finite element model with nickel mold/polymer resist structure was constructed, considering both mechanical properties of the polymer resist and optimal element number. Simulation results show that there exist the optimum friction coefficient and the optimum cohesion allowing the deformation of the polymer resist to be minimal. These optimum contact properties can be applied in guiding selections of material and improving quality of embossed patterns.

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Section: Materials Propertiesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effects of Friction Coefficient and Cohesion between a Mold and a Polymer Resist during Demolding Process in Hot Embossing

Zhang

Wang

Zheng

et al. 2016

J. Photopol. Sci. Technol.

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“…The importance of the surface finishing direction was highlighted by several including Burke and Malloy and [3,6]. Intermittent tool smearing which may result from tool fabrication, such as with micro milling, increases the degree of mechanical interlocking.…”

Section: Factors Affecting Demoulding Forcementioning

confidence: 99%

“…Worgull et al [6,28] observed that demoulding forces may vary by several factors depending on the process parameters selected and the quality of the tool. A test apparatus which can be used in a tensile testing machine was described and results presented based on varying parameters.…”

Section: Determining a Suitable Coefficient Of Frictionmentioning

confidence: 99%

Demoulding Force Prediction for Micro Polymer Replication: A Review of Relevant Literature

Delaney¹,

Bissacco²,

Kennedy³

2010

Proceedings of the 7th International Conference on Multi-Material Micro Manufacture

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Demoulding components without damage to either the components or tool is critical to successful replication processes. During tooling development designers strive to optimize replication tools to minimize demoulding force and resultant stress on replicated parts. A critical element of this process is an accurate demoulding force prediction model. Various models have been proposed to predict demoulding forces, each showing limitations in its applicability. This paper reviews existing demoulding force models and parameters affecting demoulding force for micro polymer replication.

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“…After the crack has propagated, the stress distribution in z 23 ; the residual polymer layer below the post feature, changes from a constant stress across the layer into a varying stress, dependent on the depth and radial distance. Initially, a solution derived from bi-harmonic principles was utilized.…”

Section: Residual Layer Stress Distributionmentioning

confidence: 99%

Optimization of micro and nanoimprint de-embossing by elastic fracture modelling

Balla

Spearing

2013

Microelectronic Engineering

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A semi-analytical model is presented for the de-embossing phase of the nanoimprint patterning process. The model is based on established principles of elastic fracture mechanics as developed for fibre-bridged cracking in composites. De-embossing is idealised as a steady-state fracture process, which enables the energy change to be considered by reference to a unit cell of a cylindrical polymer post, de-embossing from an axisymmetric stamp. The model provides predictions of the achievable limits for de-embossing as a function of key geometrical variables such as feature size, area ratio and aspect ratio and material properties such as interfacial adhesion, shear strength, polymer yield strength and the ratio of the elastic moduli of the polymer and the stamp. Process 'maps' have been created showing de-embossing limits. A strong dependence of the achievable aspect ratio on the pattern area ratio and the interfacial shear stress is seen. For polymer yield stresses similar to that of PMMA, the critical interfacial strain energy release rate has little effect on de-embossing. Large area and aspect ratios are predicted to be achievable by keeping the ratio of polymer and stamp Young's moduli between 0.015 and 2.5. The model provides key insights into the physical origins of previously observed limits on the achievable aspect ratios and area ratios achieved by imprint patterning. Keywords NIL, nanoimprint, de-embossing, analytical, modelling, process maps Notation R = unit cell radius, δ = displacement, z = distance, z = slip length, τ = shear stress, σ = applied stress, r = radius, f = area fraction, G iC = critical interfacial strain energy release rate, U = strain energy, A = area, E = Young's modulus, V sl = sliding frictional energy, AR = aspect ratio, R E = Young's moduli ratio. Subscripts 0-3 = longitudinal regions of the stamp model, a-c = model state, T = total, p = polymer, c = composite of stamp and polymer, s = stamp yp = polymer yield stress, ys = stamp yield stress, r = radial direction, z = longitudinal direction, rl = residual layer, st = stamp top.

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Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication

Cited by 42 publications

References 5 publications

Effects of Friction Coefficient and Cohesion between a Mold and a Polymer Resist during Demolding Process in Hot Embossing

Effects of Friction Coefficient and Cohesion between a Mold and a Polymer Resist during Demolding Process in Hot Embossing

Demoulding Force Prediction for Micro Polymer Replication: A Review of Relevant Literature

Optimization of micro and nanoimprint de-embossing by elastic fracture modelling

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