Theoretical investigations of the influence of grain size (D) and doping density (NA), on the carrier concentration (p*) and effective resistivity (ϱ*) of polycrystalline silicon are made, considering the finite thickness (2t) of the grain boundary region and the dynamics of capture and release of carriers at the grain boundary trap‐states. It is found that for low values of impurity concentration the average carrier concentration (p*) and the effective resistivity (ϱ*) are controlled by trapping of free carriers at the grain boundary trap‐states where, as for higher doping densities, the values of p* and ϱ* tend to those of a single crystal as a result of saturation of the trapping states.