Miniaturized WiFi system module using SiP/IPD for handheld device applications

Abstract

A compact and thin WiFi SiP module using IPD (Integrated Passive Device) technology is proposed. The WiFi SiP module integrates WiFi single chip, RF front end, EEPROM, and IPD chip as a full system module that can be easily used for 802.11b/g WLAN application, especially in handheld devices. The IPD chip is designed on a silicon substrate to embed passive components required for the WiFi chip and to be a chip carrier for the active ICs integrated in the module. The IPD is fabricated on a silicon substrate using thin film process to build up low cost, high accuracy, and high quality passive elements of resistors, capacitors, and inductors. Two types of SiP approaches to implementing the WiFi modules are presented. Their dimensions are 8.5x8.5x1.3 mm 3 and 5.7x9x0.925 mm 3 , respectively. At 2.4 GHz and modulation of 54 Mbps data rate, the WiFi module can provide linear output power up to 13 dBm and its receiving sensitivity is -72 dBm.

Optimization design and simulation for a band-pass-filter with IPD technology for RF front-end application

“…There is clear indication that the overall sizereduction relies heavily on the reduction of these passive components. Conventional discrete passive components are the most widely used for wireless products, which are typically made using ceramic technology for ceramic's good electrical and thermal characteristics [2] [3]. However, integrated passives devices (IPDs) based on semiconductor processes offer the advantage of excellent parameter control, and allow simplified and compact module design IPD processes can be used to make high density capacitors high Q inductors and large value resistors [4].…”