2019
DOI: 10.3390/sym11121453
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Microwave Photonic ICs for 25 Gb/s Optical Link Based on SiGe BiCMOS Technology

Abstract: The design, simulation and experimental results of the integrated optical and electronic components for 25 Gb/s microwave photonic link based on a 0.25 µm SiGe:C BiCMOS technology process are presented. A symmetrical depletion-type Mach-Zehnder modulator (MZM) and driver amplifier are intended for electro-optical (E/O) integrated transmitters. The optical divider and combiner of MZM are designed based on the self-imaging theory and then simulated with EM software. In order to verify the correctness of the theo… Show more

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Cited by 3 publications
(2 citation statements)
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“…The directional coupler-which is the basic element of the OMT-is characterized by the coupling length L cr , at which the optical power is completely transferred from one waveguide into another. The coupling length is calculated as per Equation ( 8) and corresponds to the minimal transmission coefficient at the output of the passthrough port [43].…”
Section: Coupling Lengthmentioning
confidence: 99%
“…The directional coupler-which is the basic element of the OMT-is characterized by the coupling length L cr , at which the optical power is completely transferred from one waveguide into another. The coupling length is calculated as per Equation ( 8) and corresponds to the minimal transmission coefficient at the output of the passthrough port [43].…”
Section: Coupling Lengthmentioning
confidence: 99%
“…A multilane optical receiver with data rates exceeding hundreds of Gb/s was first functionally realized by Shibasaki, T. [2] in 2015. In order to explore performance enhancement of the optical receivers, a wide-band design of the receivers was analyzed by Kokolov, A.A. [12] in 2019, a noise optimization method was proposed by Li, D. [9] in 2016, and power and area reductions in advanced CMOS technology were made by Shahramian, S. [13] in 2019. However, there still exist some shortcomings which need to be improved in these receivers, such as bad compatibility with more than one specific operating mode; complicated trade-offs among stability [14], bandwidth, and noise [9] of the input transimpedance amplifier (TIA) stage; and high manufacturing costs due to the large chip area in SiGe BiCMOS technology, etc.…”
Section: Introductionmentioning
confidence: 99%