Microwave and millimeter wave ball grid array (BGA) packages

Abstract

In order to realize the large growth potentials of commercial wireless market segments such as local multi-point distribution services (LMDS) and point-topoint radio, system manufacturers will have to produce affordably-priced equipment for the consumer. One key issue is reducing the cost of packaging monolithic microwave integrated circuits (MMICs) for these applications, which operate in the frequency range of 18 to 40 GHz. This paper explores the applicability of ball-grid array (BGA) technology as an economical solution to microwave and millimeter-wave MMIC packaging.

Modeling of interconnections and isolation within a multilayered ball grid array package

“…2 is characterized by a set of -parameters obtained from SONNET's em package. 2 Modeled and measured phase of and agree well (Fig. 10).…”

“…They can be determined separately using the effective dielectric constant and impedance of the microstrip line. and are adjusted separately by fitting the curve of -or -parameters over a range of the frequencies, in this case up to 10 GHz, while keeping their sum as prescribed by (2).…”

“…2. Model components are extracted from the -and -parameters obtained from the HFSS simulation [6] (1) (2) where and are the through inductance and the lineto-ground capacitance of the microstrip through line. They can be determined separately using the effective dielectric constant and impedance of the microstrip line.…”

Filter embedded K-band LTCC upconverter

“…LTCC enables passive components embedded compactly and low-cost RF modules with high-density multilayered structures [1]- [3]. The current drawbacks of most RF module are their relatively large size, heavy weight primarily caused by discrete components such as the filters, and separately located modules [4].…”