A procedure is described for the electrical modeling of multilayered ball grid array (BGA) packages for use in microwave applications. The modeled package is divided into layers and a lumped-element circuit model is developed for each layer/interconnection. A simple numerical method for computing the parasitic coupling between transitions at different locations within a layer is presented and integrated with the lumped-element model. The model is verified by comparison to measurements of a test package. This modeling procedure is useful for determining the cause of low isolation in BGA packages at microwave frequencies.Index Terms-BGA, electrical isolation, microwave packaging, multichip module, package isolation, package model.

An electrical modeling procedure is described for Ball Grid Arra:ys (BGA) to be used at microwave frequencies. A lumped element circuit model for interconnection is developed and verified with measurement. The model includes the effects of solder balls, the motherboard, and layer-to-layer transitions.

No abstract

No abstract

No abstract