Electrical modeling of a BGA package for microwave applications-a layer by layer approach

Ito, Ryo; Hongsmatip, T.; Jackson, Robert W.

doi:10.1109/epep.1998.734007

Cited by 9 publications

(5 citation statements)

References 1 publication

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“…We have extracted a simple π ‐section LC model (Figure 17) for the Row‐1 interconnect from the measurement ‐ Model meas . The inductance (L) and capacitance (C) values have less than 5 per cent variation upto 6 GHz (Ito and Hongsmatip, 1998). Figure 18 shows the corresponding model obtained from simulation as a cascade of the package interconnect and the wirebond models ‐ Model sim .…”

Section: Measurement Resultsmentioning

confidence: 99%

Electrical characterisation of BGA package for RF applications

Chandrasekhar¹,

Beyne²,

Raedt³

et al. 2002

Microelectronics International

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This paper highlights the electrical behaviour of the interconnects on a 120‐pin Ball Grid Array (BGA) package from 500 MHz upto 8 GHz. The measurements are made using IMEC's MCM‐D thin film technology as the substrate and with a test set‐up called MoPoM (MCM‐on‐Package‐on‐MCM). The interconnects are classified based on length and measured with adjacent interconnects grounded as well as floating. Circuit models are extracted from the measurement and the simulation respectively for an RF interconnect including the wirebond. Comparison of the circuit models with each other and with the measurement show agreement atleast upto 6 GHz. One of the interconnects is also measured before and after globtopping and a considerable change in the impedance match is observed. The effect of package loading is found to be negligible.

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Section: Measurement Resultsmentioning

confidence: 99%

Electrical characterisation of BGA package for RF applications

Chandrasekhar¹,

Beyne²,

Raedt³

et al. 2002

Microelectronics International

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“…Analyzing the signal paths on the PSGA and a BGA [14], [15], we can see that in the case of PSGA, the wide track gives rise to small self-inductance and the small gaps lead to a large capacitance (Fig. 30).…”

Section: ) Comparison With the Bga Packagementioning

confidence: 97%

Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification

Chandrasekhar

Vandevelde

Driessens

et al. 2003

IEEE Trans. Electron. Packag. Manufact.

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We characterize the polymer stud grid array (PSGA) package electrically, thermally and thermo-mechanically for successful commercial application. For the electrical characterization, we extract lumped parameter resistance-inductance-capacitance ( ) models for the interconnects from simulations. We also measure the RF performance of the package on printed circuit board (PCB) test structures. The average self-inductance from the wirebond pad to the bottom of the stud is 0.53 nH and the total capacitance to the ground is 0.26 pF for an interconnection of the periphery of the over the edge (OTE) type PSGA. The lumped model is verified by full three-dimensional (3-D) EM simulations. Simulation models also indicate that the "Micro-via" ( -via) type of interconnection on the PSGA package improves performance by decreasing the inductance on an average by 60%. Thermal characterization involves the development of a steady-state thermal compact model with six nodes for the 72-pin PSGA. We also perform transient thermal measurements on test packages to fine-tune the detailed model. For the thermo-mechanical case we test the first level and second level reliability by experiments and optimize them using simulations. The board level reliability for the 72-pin PSGA mounted on a PCB is very high ( 50% 10000 cycles). Simulations also show a higher reliability for the PSGA than the plastic ball grid array (PBGA).

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“…2. Model components are extracted from the -and -parameters obtained from the HFSS simulation [6] (1) (2) where and are the through inductance and the lineto-ground capacitance of the microstrip through line. They can be determined separately using the effective dielectric constant and impedance of the microstrip line.…”

Section: Model Topology and Lumped-element Modelmentioning

confidence: 99%

“…In Section III, we review the procedure whereby a multilayer BGA transition is divided into layers, each layer EM simulated and then circuit modeled [6]. Using Fang's work [8] as a starting point, in Section IV we describe the extension of our procedure to include modeling of isolation.…”

Section: Introductionmentioning

confidence: 99%

“…This is especially useful when multiple monolithic microwave integrated circuits (MMIC's) are to be packaged in a minimum-sized BGA. In [6], a systematic technique was outlined for circuit modeling a chain of transitions passing Manuscript through a multilayer BGA. In this paper, we describe the technique in more detail, but more importantly, we include analysis and modeling of isolation in BGA's.…”

Section: Introductionmentioning

confidence: 99%

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Modeling of interconnections and isolation within a multilayered ball grid array package

Ito

Jackson

Hongsmatip

1999

IEEE Trans. Microwave Theory Techn.

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A procedure is described for the electrical modeling of multilayered ball grid array (BGA) packages for use in microwave applications. The modeled package is divided into layers and a lumped-element circuit model is developed for each layer/interconnection. A simple numerical method for computing the parasitic coupling between transitions at different locations within a layer is presented and integrated with the lumped-element model. The model is verified by comparison to measurements of a test package. This modeling procedure is useful for determining the cause of low isolation in BGA packages at microwave frequencies.Index Terms-BGA, electrical isolation, microwave packaging, multichip module, package isolation, package model.

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Electrical modeling of a BGA package for microwave applications-a layer by layer approach

Cited by 9 publications

References 1 publication

Electrical characterisation of BGA package for RF applications

Electrical characterisation of BGA package for RF applications

Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification

Modeling of interconnections and isolation within a multilayered ball grid array package

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