2018
DOI: 10.1109/tmtt.2018.2854160
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Microwave Acoustic Wave Devices: Recent Advances on Architectures, Modeling, Materials, and Packaging

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Cited by 110 publications
(46 citation statements)
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“…One proposed path for 5G RF acoustic devices is to scale down the critical dimensions directly (e.g., film thickness and electrode feature size) of the conventional RF acoustic platforms, such as surface acoustic wave (SAW) [6]- [8], and film bulk acoustic resonators (FBAR) [9]- [11], to operate at the sub-6 GHz bands. However, three significant challenges prohibit such an approach to meet the 5G NR requirements.…”
Section: Introductionmentioning
confidence: 99%
“…One proposed path for 5G RF acoustic devices is to scale down the critical dimensions directly (e.g., film thickness and electrode feature size) of the conventional RF acoustic platforms, such as surface acoustic wave (SAW) [6]- [8], and film bulk acoustic resonators (FBAR) [9]- [11], to operate at the sub-6 GHz bands. However, three significant challenges prohibit such an approach to meet the 5G NR requirements.…”
Section: Introductionmentioning
confidence: 99%
“…Particularly, the enhanced mobile broadband (eMBB) [3] require new components at higher frequencies for the recently released bands [4], [5]. RF acoustic elements, leveraging the technical benefits of the acoustic domain [6], hold great potentials for chip-scale and low-loss signal processing [7], [8]. The shorter acoustic wavelengths [6] lead to orders of magnitude smaller resonant structures than their EM counterparts, while the low damping of acoustic waves enables efficient passives.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, the trend to densify the integration of RF components and in particular in communication systems, coupled with the increase in operating frequencies to allow for wide bandwidths, imply an extreme miniaturization of SAW devices and therefore a very localized concentration of power. This generates an intense heating of the substrate in the vicinity of the electrodes and thus requires the use of suitable materials [ 21 ].…”
Section: Introductionmentioning
confidence: 99%