Microstructure of pure tin electrodeposited films

Teshigawara, Tomoya; Nakata, Takeshi; Inoue, Koichiro; Watanabe, Tohru

doi:10.1016/s1359-6462(01)00759-x

Cited by 13 publications

(6 citation statements)

References 2 publications

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“…A different result among all was identified for Sn[2-a] deposits with a (101) texture and omission of few lower planes. Previously electrodeposited Sn films showed (101) [22], (220) [31], (200) [31] or (112) [22] texture which is majorly different from the deposits obtained here by using various traditional reducing agents.…”

Section: Xrd Analysiscontrasting

confidence: 99%

“…The average crystallite size of these deposits was found to be ∼18 nm irrespective of bath composition or surface activating agents. Earlier electrodeposited Sn from aqueous electrolytes showed a crystallite size ranging from 50 to 400 nm [22,31]. The crystallite size of the deposit from ionic liquid electrolyte was found to be in the range of 55 to 120 nm [23].…”

Section: Xrd Analysismentioning

confidence: 95%

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Characterization of Al-induced electroless tin films on mild steel substrate for corrosion protection

Singh¹,

Ghosh²

2020

Surf. Topogr.: Metrol. Prop.

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Al-induced electroless process is used to fabricate Sn films on the mild steel substrates. The deposition reaction was performed by designing a Fe-Al galvanic couple where the optimum geometric area ratio between Fe-Al was 0.3. Additionally, NaBH 4 and NaH 2 PO 2 reducing agents were also added to enrich the deposit morphology and composition. The film surfaces were characterized by scanning electron microscopy, energy-dispersive x-ray spectroscopy and x-ray diffraction measurements. The analysis showed dense, uniform tin deposits with the presence of boron and phosphorous. The x-ray diffraction results confirmed the polycrystalline tetragonal structure with mostly (211) texture having an average 18 nm crystallite size. The anti-corrosion performance of these tin films has been studied by immersion in saltwater, open circuit potential measurement test, potentiodynamic polarization test, and electrochemical impedance spectroscopy. The effect of the coating thickness was also considered in anti-corrosion performance. The analysis showed the tin coated steel has commendable corrosion resistant property and the corrosion rate can be decreased up to 16 times with the addition of these coatings irrespective of the film thickness.

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Section: Xrd Analysiscontrasting

confidence: 99%

Section: Xrd Analysismentioning

confidence: 95%

Characterization of Al-induced electroless tin films on mild steel substrate for corrosion protection

Singh¹,

Ghosh²

2020

Surf. Topogr.: Metrol. Prop.

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“…At higher gluconate concentration, the deposition mechanism becomes a progressive nucleation process with 2-D growth control. 63 Cyclic voltammetry of a tin electrode in sodium citrate at pH 6 is studied, 62 in 0.5 dm -3 bicarbonate 60 and in a carbonate-bicarbonate mixture at pH 8.9. 66 In addition to cyclic voltammetry, potentiostatic and galvanostatic techniques are used in the study of the effects of organic additives on tin deposition and surface enhanced Raman spectroscopy technique has also been explored.…”

Section: Operating Parameters and Deposit Propertiesmentioning

confidence: 99%

A review of developments in the electrodeposition of tin

Walsh

Low

2016

Surface and Coatings Technology

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Highlights Types of aqueous electrolytes for pure tin deposits are reviewed. The many existing and developing applications of tin deposits are summarised. Emphasis is placed on versatile methanesulfonic acid electrolytes. The effects of bath composition (including additives) and operating conditions on deposit morphology are illustrated. Electrochemical studies at static and controlled flow rotating electrodes are illustrated. AbstractThe importance of tin and its electrodeposition are summarised and the scope for plating tin is outlined.Established applications of electroplated tin include corrosion protection, electronics fabrication and cooking utensils. The past 20 years have seen developments in the science and technology of tin plating, including research into nanostructured deposits, adoption of environmentally friendly methanesulfonic acid baths and more ambitious coatings including multi-layers and composites. Our ability to tailor deposit structure and composition has been improved by newer electrolytes, pulse plating and electrolyte additives. The diversity of tin applications has extended to lithium batteries using newer structures (such as composites, multi-layers and nanostructures), electrical control (e.g., pulsed current) and relative bath/electrode movement (including the use of rotating electrodes). Electrochemical aspects of modern tin deposition are illustrated by data from the authors' laboratory which highlights the versatility of methanesulfonic acid electrolytes. A wide range of deposit morphology, colour and surface finish are possible by the use of suitable addition agents and control of electrode/electrolyte movement and operating conditions. Subject areas needing further research work are identified.

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“…The electromechanical cell is working under quite stable conditions once the cathode deposit reaches a certain thickness, but the mechanical system still requires supervision, and larger cells with multiple cathodes imply higher technical challenges. Better controlling the electrocrystallization without the use of organic inhibitors may be achieved -besides optimised electrolyte and current intensity parameters [11] -by more frequent reversal/interruption of the electric current. The so far applied current cycles were in the ranges of seconds, and the best results were obtained with the shortest ones [7].…”

Section: Driving Shaftmentioning

confidence: 99%

The Effect of Micro-Impulse Current on the Morphology of Tin Electrodeposited from Chloride Solutions

Kulcsár

Dobó

Kékesi

2013

MSF

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A flexible and efficient process of tin electrorefining has been devised, using aqueous solutions of relatively low HCl and tin chloride concentrations. Any additives have been avoided, which enhances purity but also incurs the difficulty of obtaining compact cathode deposits. This feature is however assisted by the natural inhibition in complexing chloride solutions and the modulation of the current. Due to the rough dendritic crystal growth, special provisions are required to avoid short circuiting. Using short pulses in the 50-250 μs range of periodically reversed or interrupted currents, the lengths of the usually large dendrites can be moderated. The periodic current with extremely short cycle times and special electrode arrangement can be utilized for averting short circuits and for achieving better coverage of the cathode surface. This technique can be applied efficiently to obtain pure tin from soldering waste materials.

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Microstructure of pure tin electrodeposited films

Cited by 13 publications

References 2 publications

Characterization of Al-induced electroless tin films on mild steel substrate for corrosion protection

Characterization of Al-induced electroless tin films on mild steel substrate for corrosion protection

A review of developments in the electrodeposition of tin

The Effect of Micro-Impulse Current on the Morphology of Tin Electrodeposited from Chloride Solutions

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