Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈1 1 1〉 oriented and nanotwinned Cu

Lin, Han Wen; Lu, Chia Ling; Liu, Chien Min; Chen, Chih; Chen, Delphic; Kuo, Jui Chao; Tu, King‐Ning

doi:10.1016/j.actamat.2013.04.056

Cited by 48 publications

(15 citation statements)

References 16 publications

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“…6 Sn 5 degraded; the ORs between scallop-type g-Cu 6 Sn 5 and (111) Cu were: f10 10g g jj {111} Cu in h0001i g jj h011i Cu and h11 20i g jj h112i Cu . Lin et al 7 also reported that the preferred texture of g-Cu 6 Sn 5 changed as reflow time was extended. However, in the present study, the faceted prismtype g-Cu 6 Sn 5 textures were maintained even after soldering for 60 min.…”

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confidence: 97%

“…3 Fast diffusion, electromigration, and thermomigration caused by certain grain orientations have been widely confirmed. [4][5][6] Cu 6 Sn 5 essentially maintains a hexagonal structure, i.e., g-Cu 6 Sn 5 , during soldering reactions, 7,8 and this highly anisotropic phase appears to have a considerable influence on its growth and performance. The growth rate of the g-Cu 6 Sn 5 planes along the [0001] direction was about 28 times faster than that normal to the [0001] direction.…”

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confidence: 99%

“…The grain number of solder matrices, IMCs, and under bump metallization (UBM) in fine pitch interconnects will be small, maybe just a few grains, and so, anisotropic behaviors are expected. [3][4][5][6][7][8][9][10][11][12][13] Variation in grain orientation may lead to a wide distribution of the orientationdependent properties of microinterconnects, which may in turn lead to early failure and low reliability. 3 Fast diffusion, electromigration, and thermomigration caused by certain grain orientations have been widely confirmed.…”

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confidence: 99%

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Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient

Zhong

Zhao

Liu

et al. 2017

Applied Physics Letters

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As the diameter of solder interconnects in three-dimensional integrated circuits (3D ICs) downsizes to several microns, how to achieve a uniform microstructure with thousands of interconnects on stacking chips becomes a critical issue in 3D IC manufacturing. We report a promising way for fabricating fully intermetallic interconnects with a regular grain morphology and a strong texture feature by soldering single crystal (111) Cu/Sn/polycrystalline Cu interconnects under the temperature gradient. Continuous epitaxial growth of η-Cu6Sn5 at cold end liquid-Sn/(111)Cu interfaces has been demonstrated. The resultant η-Cu6Sn5 grains show faceted prism textures with an intersecting angle of 60° and highly preferred orientation with their ⟨112¯0⟩ directions nearly paralleling to the direction of the temperature gradient. These desirable textures are maintained even after soldering for 120 min. The results pave the way for controlling the morphology and orientation of interfacial intermetallics in 3D packaging technologies.

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confidence: 97%

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confidence: 99%

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confidence: 99%

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Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient

Zhong

Zhao

Liu

et al. 2017

Applied Physics Letters

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“…The formation of Cu 6 Sn 5 intermetallics could be beneficial for the mechanical properties of solder joints, as fine intermetallic particles could strengthen the solder materials and get the mechanical strength improved [4,8,9]. However, as intensive studies reveal that Cu 6 Sn 5 is a faceted phase and dramatically grows in a quick time frame during annealing or in service conditions.…”

Section: Introductionmentioning

confidence: 97%

Improvement of Ga and Zn alloyed Sn–0.7Cu solder alloys and joints

Wang

Fang

et al. 2015

J Mater Sci: Mater Electron

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In this study, it is proposed to utilize the advantages of Zn and Ga alloying to achieve improved performance Sn-0.7Cu solder alloys. As dual addition of Ga and Zn into Sn-0.7Cu alloy, wetting force increased while wetting time was reduced simultaneously. Zn promoted the nucleation of b-Sn and lead to the increase of nucleation temperatures. Meanwhile Ga reduced the melting temperature of Sn-0.7Cu. Zn addition introduced another Cu-Zn-Sn intermetallic formation, refined the microstructure. Vickers hardness of Sn-0.7Cu solder alloy and also impact shear strength of Sn-0.7Cu/Ni-Au/Cu solder joints have been obviously improved. The improvements can be attributed to Cu-Zn intermetallic acting as participation phases and solid solution strengthening brought by Ga in b-Sn matrix.

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“…Lin et al 8 found that the preferential growth of Cu 6 Sn 5 on Cu UBM with <111> orientation and nanotwinned changed from the {0001} to the 2113 È É texture after annealing. Zou et al 9 confirmed that special orientation relations existed at the interfaces between the faceted IMC/(001), faceted IMC/ (111), and scallop-like IMC/(011) single-crystal Cu substrate.…”

Section: Introductionmentioning

confidence: 99%