Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

Vidyatharran, K.; Hanim, M.A. Azmah; Dele‐Afolabi, T.T.; Matori, K.A.; Azlina, O. Saliza

doi:10.1016/j.jmrt.2021.09.067

Cited by 31 publications

(3 citation statements)

References 49 publications

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“…Particle reinforcement is the addition of second-phase reinforcing particles (metal nanoparticles, metal oxide particles, GNS, carbon nanotubes, etc.) to the lead-free solder matrix [46,47]. The modification of the solder attempts to improve its mechanical properties and microstructure, thus improving its joint reliability [23].…”

Section: Reinforcement Mechanismmentioning

confidence: 99%

A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

Yu²,

et al. 2023

Metals

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In the electronics industry, graphene is applied with modified lead-free solder. This review presents advances in the preparation, strengthening mechanisms, and property characterization of graphene composite solders. Graphene composite solders are divided into two main categories: unmodified graphene and metal-particle-modified graphene. The unmodified graphene composite solders are classified according to the different solder systems. Metal-particle-modified graphene composite solders are classified according to different metal particles. However, there are still challenges with graphene composite solders. The main challenge is the poor bonding of graphene to the substrate and the nonuniform dispersion. Future directions for the development of graphene composite solders are proposed. They can provide some reference for the development of new graphene composite solders in the future.

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Section: Reinforcement Mechanismmentioning

confidence: 99%

A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

Yu²,

et al. 2023

Metals

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“…In electronic packaging, good metallurgical bonding depends on the soldering reaction between solders and conductor metals during the soldering process. The interfacial IMC produced by the chemical reaction between the two components achieves metallurgical bonding between the solder and substrate [9]. However, the overgrowth of the interfacial IMC layer would eventually reduce the durability of the solder junction because it is inherently brittle and prone to structural flaws [10,11].…”

Section: Introductionmentioning

confidence: 99%

The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish

Dayang Izzah Nabilah Awang Azman,

Saliza Azlina Osman,

Pavithiran Narayanan

et al. 2024

ARMNE

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The selection of substrate material depends on solder joint requirements and will influence intermetallic compound (IMC) layer formation and reliability of the solder joints. Besides, using different solder materials can also affect the microstructure of IMCs formed during soldering and isothermal ageing process. This study investigated the effect of the IMC formation and microstructure evolution during reflow soldering and isothermal ageing using SN100C lead-free solders and ENIG surface finish. The characterization of the IMC formed during both reflow soldering and isothermal ageing in terms of the type, morphology, and thickness is then analyzed by using the Optical Microscope (OM), Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX). The result reveals that there are two IMC formed at an interface between SN100C and ENIG which are (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 where (Ni, Cu)3Sn4 grows beneath (Cu, Ni)6Sn5. The thickness of the IMC formation in the SN100C/ENIG solder joint is also directly proportional to the ageing duration, indicating that the longer the time of the IMC exposed to high temperature affects the thickness of the IMC.

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“…With the speedy development of the electronics industry, there are increasing requirements for soldering and brazing technologies in the packaging of microelectronic devices [3,4]. Due to the toxicity of cadmium and lead, brazing/soldering alloys containing cadmium and lead are restricted in the applications of electrical and electronic devices [5][6][7]. Therefore, substitutes with the representation of silver-based solder have been attracted attention recently [8].…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Phase Transition of Ag50.5Cu33.3Sn16.2-xInx Alloys through Experimental Study and Thermodynamic Calculation

Tong

Rong

Wang

2023

Metals

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In this study, the solidified microstructure and phase transition temperatures of Ag50.5Cu33.3Sn16.2-xInx (x = 5.0, 6.6, 8.2, 9.1, 9.9, 10.7, 11.5, 12.3; at.%) alloys were investigated using a scanning electron microscope with energy dispersive spectrometer (SEM-EDS) and differential thermal analysis (DTA). The experimental microstructure of Ag50.5Cu33.3Sn16.2-xInx alloys demonstrates that the phase fraction of Fcc(Ag) phase increased gradually as the addition of In increased, while the phase fraction of Fcc(Cu) phase decreased. Moreover, the liquidus temperatures of Ag50.5Cu33.3Sn16.2-xInx alloys also decrease with increasing In content. In this work, the Ag-Cu-Sn-In quaternary thermodynamic database was ideally extrapolated from the published literature for Ag-Cu-Sn, Ag-Cu-In, Ag-Sn-In and Cu-Sn-In thermodynamic databases. The calculated vertical section of Ag50.5Cu33.3Sn16.2-Ag50.5Cu33.3In16.2 agreed generally with the phase transition temperatures measured in the present experiment. Finally, the solidification behaviors of Ag50.5Cu33.3Sn16.2-xInx as-cast alloys were analyzed by thermodynamic calculation of the Scheil–Gulliver non-equilibrium model. The simulated solidification processes of some Ag50.5Cu33.3Sn16.2-xInx alloys are, in general, consistent with the experimental results in the present work, which would provide a theoretical basis for the design of novel Ag-Cu-Sn-In brazing alloys.

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Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

Cited by 31 publications

References 49 publications

A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish

Microstructure and Phase Transition of Ag50.5Cu33.3Sn16.2-xInx Alloys through Experimental Study and Thermodynamic Calculation

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