The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish
Dayang Izzah Nabilah Awang Azman,
Saliza Azlina Osman,
Pavithiran Narayanan
et al.
Abstract:The selection of substrate material depends on solder joint requirements and will influence intermetallic compound (IMC) layer formation and reliability of the solder joints. Besides, using different solder materials can also affect the microstructure of IMCs formed during soldering and isothermal ageing process. This study investigated the effect of the IMC formation and microstructure evolution during reflow soldering and isothermal ageing using SN100C lead-free solders and ENIG surface finish. The character… Show more
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