2013
DOI: 10.1016/j.tsf.2013.05.111
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Microstructural analysis of InGaN/GaN epitaxial layers of metal organic chemical vapor deposition on c-plane of convex patterned sapphire substrate

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Cited by 4 publications
(4 citation statements)
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“…The skew dislocation density, and pure edge and mixed dislocation densities in as-grown GaN epi-layer are estimated to be 7.9 × 10 7 , and 8.8 × 10 7  cm −2 , respectively2728. This crystalline quality of GaN-based LEDs grown on LSAT substrates is much better than traditional GaN-based LEDs prepared on sapphire and nanopatterned sapphire substrates2930313233.…”
mentioning
confidence: 91%
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“…The skew dislocation density, and pure edge and mixed dislocation densities in as-grown GaN epi-layer are estimated to be 7.9 × 10 7 , and 8.8 × 10 7  cm −2 , respectively2728. This crystalline quality of GaN-based LEDs grown on LSAT substrates is much better than traditional GaN-based LEDs prepared on sapphire and nanopatterned sapphire substrates2930313233.…”
mentioning
confidence: 91%
“…Actually, there is a ~1.5 nm blue shift in PL peak conducted at LT when compared with that at RT. This is attributed to the fact that there are high-energy carriers existing at low temperature, which lead to the low wavelength during the radiative recombination293031323345. It is widely accepted that the IQE can be estimated as the ratio of the peak PL intensities I RT at RT and I LT at LT, where the LT IQE is assumed to be 100%46.…”
mentioning
confidence: 99%
“…Particularly, III-nitride based vertical devices, such as vertical-cavity surface-emitting lasers (VCSELs), are costly and challenging to produce, thus compromising on the efficiency obtained. For example, the efficiency of devices grown on Al 2 O 3 is threatened by the introduction of high threading dislocation density (TDD) 4 5 due to a large lattice mismatch (14%) and a large difference in thermal expansion coefficients between III-nitride semiconductor and the substrate 6 7 . This high TDD causes many nonradiative recombinations and scattering centers, which will deteriorate the optical and electrical quality of III-nitride devices 8 .…”
mentioning
confidence: 99%
“…The widely used sapphire (Al 2 O 3 ) substrate has large lattice mismatch (14% with GaN) and large thermal expansion coefficient mismatch (30% with GaN) with III-Nitrides materials [30,31,32], which will introduce high threading dislocation density (TDD) [32,33] acting as nonradiative recombination and scattering centers that deteriorate the performance of LEDs [34]. Furthermore, LEDs are fabricated in a horizontal structure since the sapphire substrates are insulated, leading to that both the n- and p-contact must be established at the top surface of the devices.…”
Section: Introductionmentioning
confidence: 99%