Microscopic investigation on sintering mechanism of electronic silver paste and its effect on electrical conductivity of sintered electrodes

Yao, Shanshan; Xing, Juanjuan; Zhang, Jiefeng; Xiong, Shenghu; Yang, Yunxia; Yuan, Xiao; Li, Hongbo; Tong, Hua

doi:10.1007/s10854-018-9970-7

Cited by 22 publications

(9 citation statements)

References 25 publications

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“…Although the glass content was relatively small, the dissolution in glass and the precipitation process of the silver particles could promote sintering and accelerate the densi cation process [25,26]. To con rm that silver could dissolve in the Bi-B-Zn glass and precipitate out during the cooling process, the microstructure of the sample was further analyzed by SEM and TEM.…”

Section: The Microstructure Of Bondlinesmentioning

confidence: 99%

Microstructure and properties of a vacuum-tempered glass with low-temperature-sintered silver paste

Sun

Liu

et al. 2021

J Mater Sci: Mater Electron

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A low-temperature sintered silver paste was used for metallization on tempered glass to prepare a vacuum tempered glass by soldering with Sn 96.5 Ag 3 Cu 0.5 paste (SAC305). The effects of the glass content and the sintering temperature on the microstructures, shear strengths, and fracture mechanisms of the bondlines were investigated in detail. The microstructure of the thick silver lm and its interface with the tempered glass was characterized. The dissolution and precipitation behaviors of the silver in Bi-B-Zn glass were also analyzed. Bi 4 B 2 O 9 crystals were detected in the microstructure of the thick silver lm when the joining temperature was increased above 450 °C, which can strengthen the silver lm and the interface with the tempered glass. After soldering at 450 °C for 10 min, an excellent bondline was formed with a shear strength of 42.3 MPa and a leak rate of 7.2 × 10 -3 Pa.cm 3 /s by using the lowtemperature sintered paste, which had a composition of 80 wt.% silver and 20 wt.% glass powder. Furthermore, heat transfer tests revealed that the vacuum tempered glass had excellent thermal insulation properties. The results showed that the low-temperature sintered silver paste combined with soldering was an effective method to prepare vacuum tempered glass.

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Section: The Microstructure Of Bondlinesmentioning

confidence: 99%

Microstructure and properties of a vacuum-tempered glass with low-temperature-sintered silver paste

Sun

Liu

et al. 2021

J Mater Sci: Mater Electron

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“…Diffused junction, back surface field, and passivated emitter rear contact (PERC) architectures use high-temperature silver pastes that undergo drying and sintering at temperatures above 500 °C, during which the silver densifies and produces a conductive film. 9 On the other hand, SHJs use thin layers of hydrogenated amorphous silicon for passivation, which degrade at temperatures above 200 °C. 10 As a result, SHJ cells rely on nanoparticle-based low-temperature silver-pastes (LT-SP), which show inferior electrical performance and require greater silver content than high-temperature silver pastes.…”

Section: Introductionmentioning

confidence: 99%

“…Both technologies primarily use particle-based silver pastes for metallization but differ significantly in paste formulation. Diffused junction, back surface field, and passivated emitter rear contact (PERC) architectures use high-temperature silver pastes that undergo drying and sintering at temperatures above 500 °C, during which the silver densifies and produces a conductive film . On the other hand, SHJs use thin layers of hydrogenated amorphous silicon for passivation, which degrade at temperatures above 200 °C .…”

Section: Introductionmentioning

confidence: 99%

Investigation of Reactive Silver Ink Formula for Reduced Silver Consumption in Silicon Heterojunction Metallization

DiGregorio

Martinez-Szewczyk

Raikar

et al. 2023

ACS Appl. Energy Mater.

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Silver is the most expensive non-silicon component in photovoltaic cells. This is particularly salient for silicon heterojunction (SHJ) cells, which rely on large quantities of low-temperature silver pastes (LT-SP). SHJ cells would benefit greatly from an industrially scalable metallization process that simultaneously offers low silver consumption, low finger resistivities (<20 μΩ·cm), and low processing temperatures. Printed reactive silver inks (RSI) are an innovative candidate to this end. This work furthers the research on RSI metallization by investigating the impact of ink formula on properties pertinent to SHJ cells, including electrical properties, line width, ink splatter, silver consumption, cell performance, and adhesion. We introduce a scalable, high-throughput flexible needle contact printing approach for metallization that solves many of the issues associated with drop-on-demand printing. The printed silver fingers are characterized using electrical measurements and top-down and cross-sectional microscopy. The best performing ink, consisting of silver acetate, ethylamine, and formic acid, achieved silver fingers with total resistivities of 3.1 μΩ·cm and contact resistivities of 3.2 mΩ·cm2 when printed at 61 °C. This ink metallized a full-sized 156 mm × 156 mm SHJ cell. This is the first reported data for RSI metallization of a full-sized SHJ cell and shows how an optimized RSI can achieve similar performances to LT-SP while consuming 80–90% less silver.

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“…Usually, the adhesive for the 3D IC junction can be conventional tin–lead solder, lead-free solder, or a silver paste. The silver paste has higher bond strength, better conductivity, and excellent high temperature service performance compared to the conventional solders [ 7 , 8 , 9 ]. Due to these reasons, silver paste is a good adhesive candidate for reducing current consumption and lowering heat caused by resistance [ 10 , 11 , 12 ].…”

Section: Introductionmentioning

confidence: 99%

Low Sintering Temperature Nano-Silver Pastes with High Bonding Strength by Adding Silver 2-Ethylhexanoate

Hsu

Chen

et al. 2021

Materials

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A silver precursor (silver 2-ethylhexanoate) and silver nanoparticles were synthesized and used to prepare a low sintering temperature nano-silver paste (PM03). We optimized the amount of silver 2-ethylhexanoate added and the sintering temperature to obtain the best performance of the nano-silver paste. The relationship between the microstructures and properties of the paste was studied. The addition of silver 2-ethylhexanoate resulted in less porosity, leading to lower resistivity and higher shear strength. Thermal compression of the paste PM03 at 250 °C with 10 MPa pressure for 30 min was found to be the proper condition for copper-to-copper bonding. The resistivity was (3.50 ± 0.02) × 10−7 Ω∙m, and the shear strength was 57.48 MPa.

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Microscopic investigation on sintering mechanism of electronic silver paste and its effect on electrical conductivity of sintered electrodes

Cited by 22 publications

References 25 publications

Microstructure and properties of a vacuum-tempered glass with low-temperature-sintered silver paste

Microstructure and properties of a vacuum-tempered glass with low-temperature-sintered silver paste

Investigation of Reactive Silver Ink Formula for Reduced Silver Consumption in Silicon Heterojunction Metallization

Low Sintering Temperature Nano-Silver Pastes with High Bonding Strength by Adding Silver 2-Ethylhexanoate

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