Abstract:The constant increase in the number of microfluidic-microwave devices can be explained by various advantages, such as relatively easy integration of various microwave circuits in the device, which contains microfluidic components. To achieve the aforementioned solutions, four trends of manufacturing appear—manufacturing based on epoxy-glass laminates, polymer materials (mostly common in use are polydimethylsiloxane (PDMS) and polymethyl 2-methylpropenoate (PMMA)), glass/silicon substrates, and Low-Temperature … Show more
“…Owing to their encapsulating features, this technology is also extensively used to hermetically seal sensitive components such as RF-MEMS [133], [134] and for monolithic microfluidic devices [135], [136].…”
Section: B Resonators Filters and Phase Shiftersmentioning
Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems with high-bandwidth I/Os have become a mainstream solution to address multi Gbit/s data rates. Heterogeneous integration technologies play a vital role here in enhancing the performance and functional density, along with reducing the size and costs of such RF systems. In line with this trend, many passive components, which have once been monolithically integrated, are now implemented on ceramic or polymer-based packages. Besides these long-established material and process technologies, considerable efforts have also recently been devoted to the development of RF components on glass and glass-ceramics. Spurred by their low dielectric losses, extremely smooth surfaces, and excellent dimensional stability, glass technologies are emerging as a promising alternative for high-volume and high-performance RF applications. In this article, relevant glass materials and key enabling technologies are reviewed and put into context with well-established RF substrate technologies. Another focus is set on the latest glass-based packaging and interposer solutions ranging from MHz-to-THz frequencies. To showcase the development activities and practical accomplishments of the RF glass technology, also a large variety of key components is presented. Finally, the paper concludes by discussing future research and development directions of RF glass devices.INDEX TERMS MTT 70th Anniversary Special Issue, glass technology, dielectrics, packaging, interposer, system-on-package, interconnects, filters, antennas, antenna-in-package, millimeter wave (mm-wave).
“…Owing to their encapsulating features, this technology is also extensively used to hermetically seal sensitive components such as RF-MEMS [133], [134] and for monolithic microfluidic devices [135], [136].…”
Section: B Resonators Filters and Phase Shiftersmentioning
Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems with high-bandwidth I/Os have become a mainstream solution to address multi Gbit/s data rates. Heterogeneous integration technologies play a vital role here in enhancing the performance and functional density, along with reducing the size and costs of such RF systems. In line with this trend, many passive components, which have once been monolithically integrated, are now implemented on ceramic or polymer-based packages. Besides these long-established material and process technologies, considerable efforts have also recently been devoted to the development of RF components on glass and glass-ceramics. Spurred by their low dielectric losses, extremely smooth surfaces, and excellent dimensional stability, glass technologies are emerging as a promising alternative for high-volume and high-performance RF applications. In this article, relevant glass materials and key enabling technologies are reviewed and put into context with well-established RF substrate technologies. Another focus is set on the latest glass-based packaging and interposer solutions ranging from MHz-to-THz frequencies. To showcase the development activities and practical accomplishments of the RF glass technology, also a large variety of key components is presented. Finally, the paper concludes by discussing future research and development directions of RF glass devices.INDEX TERMS MTT 70th Anniversary Special Issue, glass technology, dielectrics, packaging, interposer, system-on-package, interconnects, filters, antennas, antenna-in-package, millimeter wave (mm-wave).
“…Furthermore, if no physical contact with a heating element is required, unique vessel geometries and materials become feasible, enabling more flexible device design. 21 One particularly exciting method of contact-free heating is microwave irradiation (i.e., dielectric heating). In contrast to proximity-based heaters, microwaves heat via direct interaction with dipolar molecules and thus can pass through vessel walls.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, if no physical contact with a heating element is required, unique vessel geometries and materials become feasible, enabling more flexible device design. 21 One particularly exciting method of contact-free heating is microwave irradiation ( i.e. , dielectric heating).…”
Many assays necessitate the use of highly concentrated acids, powerful oxidizing agents, or a combination of the two. Although microfluidic devices offer vast potential for rapid analytical interrogation at the...
“…A review of digital microfluidic devices was presented by Shiyu Chen et al [ 2 ]. Jasińska and Malecha described the proposed microfluidic modules with integrated microwave components [ 3 ].…”
The photothermocapillary (PTC) effect is a deformation of the free surface of a thin liquid layer on a solid material that is caused by the dependence of the coefficient of surface tension on temperature. The PTC effect is highly sensitive to variations in the thermal conductivity of solids, and this is the basis for PTC techniques in the non-destructive testing of solid non-porous materials. These techniques analyze thermal conductivity and detect subsurface defects, evaluate the thickness of thin varnish-and-paint coatings (VPC), and detect air-filled voids between coatings and metal substrates. In this study, the PTC effect was excited by a “pumped” Helium-Neon laser, which provided the monochromatic light source that is required to produce optical interference patterns. The light of a small-diameter laser beam was reflected from a liquid surface, which was contoured by liquid capillary action and variations in the surface tension. A typical contour produces an interference pattern of concentric rings with a bright and wide outer ring. The minimal or maximal diameter of this pattern was designated as the PTC response. The PTC technique was evaluated to monitor the thickness of VPCs on thermally conductive solid materials. The same PTC technique has been used to measure the thickness of air-filled delaminations between a metal substrate and a coating.
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