2006
DOI: 10.1109/jmems.2006.872235
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Microfabrication and Characterization of Metal-Embedded Thin-Film Thermomechanical Microsensors for Applications in Hostile Manufacturing Environments

Abstract: Effective monitoring and diagnosis of manufacturing processes is of critical importance. If critical manufacturing process conditions are continuously monitored, problems can be detected and solved during the processing cycle. However, current technology still evidently lags behind practical needs. Microfabricated thin-film thermocouples and strain gauges are attractive for their small size and fast response. It is challenging to fabricate and embed these sensors into metallic components that are widely used i… Show more

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Cited by 28 publications
(10 citation statements)
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“…Recently, thermomechanical phenomena were studied by the use of embedded thin-film sensors for various manufacturing processes [18][19][20][21][22][23][24]. Two types of thin-film microsensors, K-type TFTC, and K-type thermocouple based TETP, were designed and fabricated for in-situ temperature measurement of ultrasonic welding process to better understand the process [18,22].…”
Section: Introductionmentioning
confidence: 99%
“…Recently, thermomechanical phenomena were studied by the use of embedded thin-film sensors for various manufacturing processes [18][19][20][21][22][23][24]. Two types of thin-film microsensors, K-type TFTC, and K-type thermocouple based TETP, were designed and fabricated for in-situ temperature measurement of ultrasonic welding process to better understand the process [18,22].…”
Section: Introductionmentioning
confidence: 99%
“…This design, therefore, decreases the sensitivity and response time of the TC. Thin-film TCs on the other hand, promises a fast response rate and high accuracies as a consequence of the absence of airgaps in the thermocouple materials, but they are very challenging to fabricate [15,16]. With all these challenges, further research is needed to develop special TCs of improved performances and longevity to meet the ever-growing demands of industries.…”
Section: Introductionmentioning
confidence: 99%
“…Aluminum has a CTE of about 21 × 10 −6 K −1 , whereas silicon-based sensors have a CTE of 2.6 × 10 −6 K −1 . This inconsistency between the two materials results in high failure rates caused by thermally induced mechanical stress during the cooling of the cast component [ 2 , 3 , 4 ].…”
Section: Introductionmentioning
confidence: 99%