in such areas. [2] The ideal efficiency of solar energy conversion of plasmonic metalbased hybrid catalysts comes from anisotropic crystallization, heterointerface. [3] Besides the morphology of plasmonic metal nanocrystals (NCs), the solar energy conversion efficiency of plasmonic metalsemiconductor NCs should be sensitive to the manner of coupling between metal NCs and the semiconductor. [4] Therefore, it is highly desirable to explore a versatile strategy to synthesize accurately controlled anisotropic configuration, monocrystalline shell, and intended site-selective heterocontact between plasmonic metal and semiconductor.The absorbance range is an essential factor on the efficiency of light harvesting and photoelectric catalysis. So far, most of the applications based on plasmonic metal hybrid NCs are limited in specific spectral range, because most of plasmonic metal nanostructures only have plasmon resonances in the visible regions. [5] Au nanorods (NRs), [6] because of its intriguing longitudinal surface plasmon resonance (LSPR), can be excited by incident light polarized along the axial direction. Therefore, it can be synthetically tailored across a broad spectral range and In this communication, light harvesting and photoelectrochemical (PEC) hydrogen generation beyond the visible region are realized by an anisotropic plasmonic metal/semiconductor hybrid photocatalyst with precise control of their topology and heterointerface. Controlling the intended configuration of the photocatalytic semiconductor to anisotropic Au nanorods' plasmonic hot spots, through a water phase cation exchange strategy, the site-selective overgrowth of a CdSe shell evolving from a core/shell to a nanodumbbell is realized successfully. Using this strategy, tip-preferred efficient photoinduced electron/hole separation and plasmon enhancement can be realized. Thus, the PEC hydrogen generation activity of the Au/CdSe nanodumbbell is 45.29 µmol cm −2 h −1 (nearly 4 times than the core/shell structure) beyond vis (λ > 700 nm) illumination and exhibits a high faradic efficiency of 96% and excellent stability with a constant photocurrent for 5 days. Using surface photovoltage microscopy, it is further demonstrated that the efficient plasmonic hot charge spatial separation, which hot electrons can inject into CdSe semiconductors, leads to excellent performance in the Au/CdSe nanodumbbell.The ORCID identification number(s) for the author(s) of this article can be found under https://doi.org/10.1002/aenm.201803889.Including the visible light (400-700 nm), the light harvest beyond visible (λ > 700 nm with ≈43% ratio of solar energy) to contribute effective photocatalysis is important but rarely studied. [1] Plasmonic metal based anisotropic metal-semiconductor hybrid nanostructures emerge to be potential materials for applications
Yolk–shell hybrid nanoparticles with noble metal core and programmed semiconductor shell composition may exhibit synergistic effects and tunable catalytic properties. In this work, the hydrothermal cation exchange synthesis of Au@ZnS–AgAuS yolk–shell nanocrystals (Y–S NCs) with well‐fabricated void size, grain‐boundary‐architectured ZnS–AgAuS shell and in situ generated Au cocatalyst are demonstrated. Starting from the novel cavity‐free Au@AgAuS core‐shell NCs, via aqueous cation exchange reaction with Zn2+, the gradual evolution with produced Au@ZnS–AgAuS Y–S NCs can be achieved successfully. This unprecedented evolution can be reasonably explained by cation exchange initialized chemical etching of Au core, followed by the diffusion through the shell to be AgAuS and then ZnS. By hydrothermal treatment provided optimal redox environment, Au ions in shell were partially reduced to be Au NCs on the surface. The UV–vis absorption spectra evolution and visible light photocatalytic performances, including improved photodegradation behavior and photocatalytic hydrogen evolution activity, have demonstrated their potential applications. This new one‐pot way to get diverse heterointerfaces for better photoinduced electron/hole separation synergistically can be anticipated for more kinds of photocatalytic organic synthesis.
A lack of sensing techniques with desired spatial and temporal resolutions at critical locations has hindered the real-time monitoring of many manufacturing processes. Micro thin film sensors, when properly implemented, can offer tremendous benefits for real-time sensing in those processes. In this study, a batch production of micro thin film sensor arrays on nickel was realized by transferring thin film sensors from silicon wafers directly into nickel substrates through standard microfabrication and electroplating techniques. To demonstrate the potential applications, micro sensor arrays that consist of multiple thermocouples and thermopiles were designed, fabricated and transferred into the electroplated nickel to study temperature field and heat generation during meso-scale ultrasonic welding. Sensor arrays are arranged immediately adjacent to the meso-scale welding area for in situ temperature and surface heat flux measurements. With the high temporal and spatial temperature data, a numerical method was developed to estimate the time resolved heat generation at the welding interface.
Real time monitoring, diagnosis, and control of numerous manufacturing processes is of critical importance in reducing operation costs, improving product quality, and shortening response time. Current sensors used in manufacturing are normally unable to provide measurements with desired spatial and temporal resolution at critical locations in metal tooling structures that operate in hostile environments (e.g., elevated temperatures and severe strains). Microsensors are expected to offer tremendous benefits for real time sensing in manufacturing processes. Rapid tooling, a layered manufacturing process, could allow microsensors to be placed at any critical location in metal tooling structures. However, a viable approach is needed to effectively integrate microsensors into metal structures during the process. In this study, a novel batch production of metal embedded microsensor units was realized by transferring thin-film sensors from silicon wafers directly into nickel substrates through standard microfabrication and electroplating techniques. Ultrasonic metal welding (USMW) was studied to obtain optimized process parameters and then used to integrate nickel embedded thin-film thermocouple (TFTC) units into copper workpieces. The embedded TFTCs successfully survived the welding tests, validating that USMW is a viable method to integrate microsensors to metallic tool materials. Moreover, the embedded microsensors were also able to measure the transient temperature in situ at 50μm directly beneath the welding interface during welding. The transient temperatures measured by the metal embedded TFTCs provide strong evidence that the heat generation is not critical for weld formation during USMW. Metal embedded microsensors yield great potential to improve fundamental understanding of numerous manufacturing processes by providing in situ sensing data with high spatial and temporal resolution at critical locations.
A new tactic for integrating multinary alloyed semiconductors and plasmonic metals into hybrid nanocrystals is developed based on aqueous cation exchange.
Au@SnS and Au@SnS core-shell hybrid nanocrystals (HNCs) were respectively accessed via an aqueous cation exchange-mediated growth strategy by using different phosphine ligands. The choice of proper ligands during synthesis is imperative to optimize the photoelectrochemical performance of these previously hardly accessible HNCs that manifest compelling plasmon-exciton interactions.
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