2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2017
DOI: 10.1109/itherm.2017.7992519
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Microfabricated thin silicon vapor chamber for low profile thermal management

Jianying Liang
1
,
Muhannad S. Bakir
2
,
Yogendra Joshi
3
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Cited by 4 publications
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References 24 publications
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Design and fabrication of an ultra-thin silicon vapor chamber for compact electronic cooling

Struss
1
,
Coudrain
2
,
Colonna
3
et al. 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
6
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Design and fabrication of an ultra-thin silicon vapor chamber for compact electronic cooling

Struss
1
,
Coudrain
2
,
Colonna
3
et al. 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
6
0
1
0
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High Performance, Multilayer Copper-Graphene Micro-Foam Wicks for Vapor Chambers

Moss
1
,
Αντωνίου
2
,
Smet
3
2023
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Theoretical Study of Miniaturization of a Silicon Vapor Chamber for Compact Microelectronics

Struss
1
,
Coudrain
2
,
Colonna
3
et al. 2018
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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