Microcircuit Accelerated Testing Using High Temperature Operating Tests

Stitch, Morton; Johnson, G. M.; Kirk, Bruce P.; Brauer, Joseph B.

doi:10.1109/tr.1975.5215180

Cited by 31 publications

(11 citation statements)

References 5 publications

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“…In each iteration of. "pattern" search (a pattern is a set of the combination of xt.xl, and x' which is abbreviated as X), we set tJ,L to tij,L at the beginning and subsequently reset it by the following algorithm: Mountsinger and Eyring models are also used by some analysts (Stitch et al, [16]; Blanks, [5]) to model the relation between accelerated life testing and burn-in time. But, as pointed out by Kuo and Kuo [13], Blanks [5], and Stitch et al [16], the temperature dependence of failure rate makes it difficult to determine the activation energy (Ea).…”

Section: Algorithm To Set Tjlmentioning

confidence: 99%

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Optimal Burn-in Simulation on Highly Integrated Circuit Systems

Chien

Kuo

1992

IIE Transactions

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Section: Algorithm To Set Tjlmentioning

confidence: 99%

“…Equation (13) indicates that the maximum attainable subsystemreliability at time t, occurs when all the components are (16) Antithetic method (Bratley et al [6]) is applied to reduce the variance since (16) is a monotonic function.…”

Section: Reliabilitymentioning

confidence: 99%

Optimal Burn-in Simulation on Highly Integrated Circuit Systems

Chien

Kuo

1992

IIE Transactions

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“…40 * Early failure distri butions found during accelerated thermal aging, and consistent with lognormal characterization, have also been found for transistors 218 ' 23 and Complementary Metal-Oxide Semiconductor (CMOS) integrated circuits. 41 In summary, early or infant failures have the potential for being either of the chance or preordained types.…”

Section: Infant (Preordained or Chance) Failurementioning

confidence: 99%

“…Although it characterized the lifetimes of GaAlAs/GaAs lasers operating at 70°C, it strongly resembles the S-shaped lifetime distributions found during the accelerated thermal aging of transistors 18,23 and CMOS intergrated circuits. 41 It is usual 18 · 23 · 41 to define the early failure group in accelerated thermal aging as the "freak" population. The remaining larger population is assumed to be controlled by a single longer-term (wear-out) mode, since the relevant failures are lognormally distributed.…”

Section: Laser Reliability 683mentioning

confidence: 99%

Selection of a Laser Reliability Assurance Strategy for a Long-Life Application

Nash

Joyce

Hartman

et al. 1985

At&T Technical Journal

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We are concerned with assuring the reliability of semiconductor lasers intended for an application in which the design lifetime is long, replacement or redundancy is impossible or impractical, and the failure of even a few lasers could be disastrous. In the search for a reliability assurance strategy that will meet our objectives, we have carefully examined the well-known and widely used bathtub and lognormal approaches. Based upon our understanding of the expected aging behavior of lasers, we propose an alternative reliability assur ance strategy that we believe to be an improvement over the traditional approaches. The object is not how to make reliable lasers, but rather how to confidently predict, in a timely fashion, which lasers in a given population will endure beyond the intended system lifetime. Particular emphasis is placed upon initially imposed overstress regimes that address the anticipated presence of transient modes of degradation and infant failure modes with low thermal activation energies that may be invulnerable to detection during accelerated thermal aging. Since lasers degrade gradually rather than fail suddenly, comparable emphasis is placed upon monitoring the stabilized long-term degradation rates of the survivors of the overstress regimes so as to permit lifetime predictions of individual lasers.

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“…The normalized complexity C, of each component is calculated by (4) with data of the complexity of each component in column 6 in the Table 1 and Table 2, respectively.…”

Section: Calculations Of the Acceleration Factor Of Pbasmentioning

confidence: 99%

Assessment of failure rate of printed board assemblies by the high temperature accelerated life test

Young

Yoo²

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

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In this paper, we summarize the work in the field of assessing the reliability of printed board assemblies of a switching system, applying the method of the high temperature accelerated life-test. A test for reliability assessement of printed board assemblies having many different kinds of components in a large varity of complexity is very important to classify the failures. We calculate the acceleration factor of taking into consideration of the complexity of a printed board assembly. An actual accelerated test with accelerated factors obtained by the Arrhenius are conducted with 30 samples during two months. Test result are analyzed applying the Weibull-log linear model. The analysis show that the design characteristics are adequate to satisfy the requirement of reliability. 0-7803-3929-0/97 $8.00 81997 IEEE 1 1997 IEEE/CPMT Infl Electronics Manufacturing Technology Symposium

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Microcircuit Accelerated Testing Using High Temperature Operating Tests

Cited by 31 publications

References 5 publications

Optimal Burn-in Simulation on Highly Integrated Circuit Systems

Optimal Burn-in Simulation on Highly Integrated Circuit Systems

Selection of a Laser Reliability Assurance Strategy for a Long-Life Application

Assessment of failure rate of printed board assemblies by the high temperature accelerated life test

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