Assessment of failure rate of printed board assemblies by the high temperature accelerated life test

Abstract

In this paper, we summarize the work in the field of assessing the reliability of printed board assemblies of a switching system, applying the method of the high temperature accelerated life-test. A test for reliability assessement of printed board assemblies having many different kinds of components in a large varity of complexity is very important to classify the failures. We calculate the acceleration factor of taking into consideration of the complexity of a printed board assembly. An actual accelerated test with accelerated factors obtained by the Arrhenius are conducted with 30 samples during two months. Test result are analyzed applying the Weibull-log linear model. The analysis show that the design characteristics are adequate to satisfy the requirement of reliability. 0-7803-3929-0/97 $8.00 81997 IEEE 1 1997 IEEE/CPMT Infl Electronics Manufacturing Technology Symposium