Optimal Burn-in Simulation on Highly Integrated Circuit Systems

Optimal burn-in for maximizing reliability of repairable non-series systems

“…The Poisson and negative binomial distributions given in Eqs. (6) and (8) are used for the number of assembly defects in parallel-series systems and bridge systems, respectively. Table 1 lists the input parameters (in hours) chosen arbitrarily for the numerical calculations.…”

A nonparametric Bayes approach to decide system burn-in time

“…We will take the information of the individual dies and PCKT as the prior information to help set up the burn-in strategy with limited number of the systems. The Arrhenius model (Chien and Kuo [5]) is used for time transformation because of its popularity and the support from many field reports. The system burn-in time is set at 80ЊC to avoid doing any damage to temperature-vulnerable components as shown in Chien and Kuo [5].…”

“…The Arrhenius model (Chien and Kuo [5]) is used for time transformation because of its popularity and the support from many field reports. The system burn-in time is set at 80ЊC to avoid doing any damage to temperature-vulnerable components as shown in Chien and Kuo [5]. From Bellcore [2], reading of the accelerated factor from Curve #7 for 80ЊC is 5.4 (i.e., burning-in the sample for 1 h is equivalent to using the sample for 5.4 h in its operational profile when the system ambient temperature is 40ЊC at the operational condition).…”

A general model of heterogeneous system lifetimes and conditions for system burn‐in

“…This test is known as burn-in [15]. If a manufacturer produces a population of engineered systems using mechanical, electrical, or electronic components, then burn-in typically involves a two-step process: Component burn-in detects weak components before they are placed in systems, while system burn-in discovers assembly problems [8,15,20,22].…”