1989
DOI: 10.1109/3.35223
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Microchannel heat sinks for two-dimensional high-power-density diode laser arrays

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Cited by 104 publications
(37 citation statements)
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“…[4]. Generally, the temperature of unidirectional flow heat exchangers, including our structures, varies by 2 C across the heat source surface.…”
Section: B Performance Of the Thermal Modulesmentioning
confidence: 97%
“…[4]. Generally, the temperature of unidirectional flow heat exchangers, including our structures, varies by 2 C across the heat source surface.…”
Section: B Performance Of the Thermal Modulesmentioning
confidence: 97%
“…Researchers such as Missaggia et al [9], Patel et al [10], and Benett et al [11] have been examining the use of MCCs for laser diode arrays since the late 1980s. Missaggia et al [9] experimentally investigated the use of a parallel MCC for dissipating heat from a twodimensional diode laser array.…”
Section: Introductionmentioning
confidence: 98%
“…We used a dicing saw to cut microchannels into the bottom of the Si heat sink [58,60]. Figure 10, a photomicrograph of the sawed cross section of a portion of an actual hybrid array, shows a linear array mounted in an etched groove in a microchannel Si heat sink.…”
Section: Two-dimensional Surface Emitting Arrays Ofgaas/aigaas Diode mentioning
confidence: 99%
“…Theoretical calculations [55][56][57] and experimental results [58,60] indicate that with a reasonable cooling- of the Si heat sink) and that the microchannels themselves can be treated as having an effective heat transfer coefficient h eff "2. 20 W/cm 2 _ 0 C. The hybrid devices reported here have their linear laser arrays mounted junction side up, which adds to the CW thermal resistance.…”
Section: Two-dimensional Surface Emitting Arrays Ofgaas/aigaas Diode mentioning
confidence: 99%
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