Fabrication of metallic heat exchangers using sacrificial polymer mandrils

Arias, Francisco J.; Oliver, Scott R. J.; Xu, Bing; Holmlin, R. Erik; Whitesides, George M.

doi:10.1109/84.911098

Cited by 35 publications

(23 citation statements)

References 23 publications

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“…Examples of metal-based passive and active MEMS include micro-heat-exchangers (Arias et al 2001) and micro-electromagnetic-relays (Williams and Wang 2004). Construction of these nontraditional metal-based MEMS often requires the fabrication of metal-based high-aspect-ratio microscale structures (HARMS), with heights on the order of several hundred micrometers.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of high-aspect-ratio microscale Ta mold inserts with micro electrical discharge machining

et al. 2006

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We report fabrication of microscale Ta mold inserts by micro-electrical-discharge-machining (lEDM). Morphology, chemistry, and structure of the near-surface region of as-lEDMed Ta blanks have been characterized by scanning electron microscopy, X-ray photoelectron spectroscopy, and transmission electron microscopy. A TaC surface layer forms on as-lEDMed Ta surfaces. This altered surface layer was removed by electro-chemical-polishing. Further modification of Ta insert surfaces was accomplished by deposition of a conformal Ti-containing hydrogenated carbon coating. We demonstrate successful replication of high-aspectratio microscale structures in Al and Cu by compression molding with such surface-engineered Ta mold inserts.

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Section: Introductionmentioning

confidence: 99%

Fabrication of high-aspect-ratio microscale Ta mold inserts with micro electrical discharge machining

et al. 2006

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“…[12,13] Techniques based on LIGA (Lithographie, Galvanoformung, und Abformung) produce even more complicated metallic objects by depositing a metal onto a molded polymer template that is subsequently removed to yield an open structure (such as a honeycomb arrangement of cells). [14,15] In principle, these approaches can be used to pattern metals of any thickness to produce features with an aspect ratio that is larger than that produced using electroplating. Solder reflow is a standard technique in electronic packaging, [16,17] and has recently been combined with micromolding in channels to form custom-made solder pieces for batches of chips.…”

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confidence: 99%

Microsolidics: Fabrication of Three‐Dimensional Metallic Microstructures in Poly(dimethylsiloxane)

et al. 2007

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This Communication describes a method of fabricating complex metallic microstructures in 3D by injecting liquid solder into microfluidic channels, and allowing the solder to cool and solidify; after fabrication, the metallic structures can be flexed, bent, or twisted. This method of fabrication-which we call microsolidics-takes advantage of the techniques that were developed for fabricating microfluidic channels in poly(dimethylsiloxane) (PDMS) in 2D and 3D, uses surface chemistry to control the interfacial free energy of the metal-PDMS interface, and uses techniques based on microfluidics, but ultimately generates solid metal structures. This approach makes it possible to build flexible electronic circuits or connections between circuits, complex embedded or freestanding 3D metal microstructures, 3D electronic components, and hybrid electronic-microfluidic devices.There are several techniques for making metal microstructures in 3D. Electroplating and electroless deposition are routinely used to construct microstructures with metallic layers several nanometers to several microns thick in 2D or 3D. [1][2][3][4][5][6][7][8][9][10][11] To generate solid replicas of 3D objects, several groups have developed a technique, referred to as "microcasting", to form metals in order to fabricate microparts (e.g., posts and gears) with features as small as 10 lm and aspect ratios as high as 10 from steel, zirconia, and alumina. [12,13] Techniques based on LIGA (Lithographie, Galvanoformung, und Abformung) produce even more complicated metallic objects by depositing a metal onto a molded polymer template that is subsequently removed to yield an open structure (such as a honeycomb arrangement of cells). [14,15] In principle, these approaches can be used to pattern metals of any thickness to produce features with an aspect ratio that is larger than that produced using electroplating. Solder reflow is a standard technique in electronic packaging, [16,17] and has recently been combined with micromolding in channels to form custom-made solder pieces for batches of chips.[18] The technique has also been used to form 3D connections (e.g., bridging opposite sides of an electronic circuit board or substrate): Lauffer and co-workers and Ference and co-workers describe similar approaches to bridge electrical "islands" of metal by heating solid rods of solder "on chip"-the solder flows along trenches, holes, or metal strips (formed lithographically) and produces electrically conductive wires between the top and bottom surfaces of the substrate. [19,20] A growing interest in flexible sensors and displays has fueled the development of polymer-metal composites. Research in this field includes composites of metal in PDMS with optical functions, [21] conductive PDMS-carbon nanotube composites, [22,23] substrates for surface-enhanced Raman spectroscopy, [24,25] spherically curved metal oxide semiconductor field-effect transistors, [26] and flexible gold-polymer nanocomposites as passive components. [27,28] In addition to materials with electrica...

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“…Metallic HARMS can be used in heat exchangers (Arias et al 2001) and electromagnetic relays for high power applications (Williams and Wang 2004). Metallic HARNS can function as components in subwavelength photonic devices (Maier 2006).…”

Section: Introductionmentioning

confidence: 99%

Direct microscale imprinting of Al at room temperature with Si inserts

et al. 2008

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For direct imprinting of metals, hard materials such as diamond and SiC have been used to construct mold inserts in preference to Si, despite the ease in fabricating Si-based micro-/nano-scale structures. In this communication, we demonstrate that micron scale Al structures can be replicated with good fidelity at room temperature by compression molding with Si inserts without incurring insert damage. We further report on results of a finite element analysis of the mechanics of the molding process. The finite element results provide some understanding of the observed lack of damage to the Si inserts.

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Fabrication of metallic heat exchangers using sacrificial polymer mandrils

Cited by 35 publications

References 23 publications

Fabrication of high-aspect-ratio microscale Ta mold inserts with micro electrical discharge machining

Fabrication of high-aspect-ratio microscale Ta mold inserts with micro electrical discharge machining

Microsolidics: Fabrication of Three‐Dimensional Metallic Microstructures in Poly(dimethylsiloxane)

Direct microscale imprinting of Al at room temperature with Si inserts

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