Micro-Texturing into the Graphite Part for Joining and Packaging

Ikhsani, Ridha N.; Santjojo, Dionysius Joseph Djoko Herry; Sakti, Setyawan P.; Aizawa, Tatsuhiko; Yunata, Ersyzario Edo

doi:10.1109/seatuc.2018.8788846

Cited by 2 publications

(1 citation statement)

References 10 publications

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“…In the following experiments, the film thickness was constant at 10 µm, as depicted in Figure 3a. VAG bulk solid was also prepared by plasma-enhanced CVD as a c-axis-oriented pyrolytic graphite block with 300 mm × 300 mm × 20 mm [10]. The VAG specimen was cut and sliced from this block to have a size of 11 mm × 22 mm × 1 mm.…”

Section: Preparation Of Thick Dlc-coated Substrate and Thick Graphitementioning

confidence: 99%

Plasma Oxidation Printing into DLC and Graphite for Surface Functionalization

Aizawa¹,

Wasa²,

Nogami³

2019

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A diamond-like carbon (DLC) film, coated on a AISI420-J2 stainless steel substrate and vertically aligned graphite (VAG), was structured by high-density plasma oxidation to work as a DLC-punch for micro-stamping and DLC-nozzle array for micro-dispensing, in addition to acting as a copper-plated thermal spreader, respectively. Thick DLC films were micro-patterned by maskless lithography and directly plasma-etched to remove the unmasked regions. Thick VAG (Ca plates were micro-patterned by screen-printing and selectively etched to activate the surface. Raman spectroscopy as well as electric resistivity measurement proved that there was no degradation of VAG by this surface activation. Wet plating was utilized to prove that copper wettability was improved by this surface treatment.

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Section: Preparation Of Thick Dlc-coated Substrate and Thick Graphitementioning

confidence: 99%

Plasma Oxidation Printing into DLC and Graphite for Surface Functionalization

Aizawa¹,

Wasa²,

Nogami³

2019

Self Cite

View full text Add to dashboard Cite

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Robust Packaging of Vertically Aligned Graphite Substrate by Copper Micro-Rib Structuring

Aizawa

Naka

Nasu

et al. 2022

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Vertically aligned graphite substrate (VGS)–copper packaging was renowned for improving the robustness against the thermal gradient loading by using micro texturing. The micro-groove array with a line width of 50 μm and a pitch of 100 μm was formed into the VGS by controlling the line depth with the use of fast-rate oxygen plasma etching. Three micro-grooved VGS specimens were wet-plated to fill these microgrooves with copper deposits and to cover the VGS surfaces. The nearly full-deposited VGS-Copper specimens were subjected to a severe thermal transient loading test. The simply Cu-covered package and shallow rib-structured VGS-Cu packages were damaged to delaminate at their interfaces. The VGS-Cu package with the copper rib structure with a height of 50 μm experienced no delamination. This rib-structured VGS-copper package with high rib height had sufficient robustness against the severe thermal transients even with the proof of homogeneous thermal spreading capacity.

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Micro-Texturing into the Graphite Part for Joining and Packaging

Cited by 2 publications

References 10 publications

Plasma Oxidation Printing into DLC and Graphite for Surface Functionalization

Plasma Oxidation Printing into DLC and Graphite for Surface Functionalization

Robust Packaging of Vertically Aligned Graphite Substrate by Copper Micro-Rib Structuring

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