Vertically aligned graphite substrate (VGS)–copper packaging was renowned for improving the robustness against the thermal gradient loading by using micro texturing. The micro-groove array with a line width of 50 μm and a pitch of 100 μm was formed into the VGS by controlling the line depth with the use of fast-rate oxygen plasma etching. Three micro-grooved VGS specimens were wet-plated to fill these microgrooves with copper deposits and to cover the VGS surfaces. The nearly full-deposited VGS-Copper specimens were subjected to a severe thermal transient loading test. The simply Cu-covered package and shallow rib-structured VGS-Cu packages were damaged to delaminate at their interfaces. The VGS-Cu package with the copper rib structure with a height of 50 μm experienced no delamination. This rib-structured VGS-copper package with high rib height had sufficient robustness against the severe thermal transients even with the proof of homogeneous thermal spreading capacity.
An acicular microtextured sheet was developed as a heat radiation device from the high-temperature source to the cooling medium in the infrared (IR) spectrum. The copper surface was modified by acicular micro-texturing to place a semi-regular micro-/nano-cone structure onto it. FT-IR (Fourier transformation IR) spectroscopy was utilized to measure the transmittance diagram in near-IR to far-IR wavelengths. The wavelength (λ) of 6.7 μm, where the highest absorbance valley was detected in the diagram, was equivalent to the doubled size of the micro-cone average height, with Have = 3.3 μm; λ ~ 2 × Have. The electromagnetic waves in the far-IR wavelength were emitted by acicular micro-textured metallic sheets. The heat radiation transfer experiment was performed to describe this low-temperature heat radiation behavior. No temperature rise was detected on the black-colored polycarbonate (BC-PC) plate away from the bare copper sheet without textures, located on the high-temperature source. The temperature increased by 4 K on the BC-PC plate using the acicular textured copper sheet device. The emitter temperature also decreased significantly by 50 K or 50% of the heat source temperature.
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