2019
DOI: 10.3390/c5010011
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Plasma Oxidation Printing into DLC and Graphite for Surface Functionalization

Abstract: A diamond-like carbon (DLC) film, coated on a AISI420-J2 stainless steel substrate and vertically aligned graphite (VAG), was structured by high-density plasma oxidation to work as a DLC-punch for micro-stamping and DLC-nozzle array for micro-dispensing, in addition to acting as a copper-plated thermal spreader, respectively. Thick DLC films were micro-patterned by maskless lithography and directly plasma-etched to remove the unmasked regions. Thick VAG (Ca plates were micro-patterned by screen-printing and se… Show more

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Cited by 4 publications
(4 citation statements)
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“…As stated in [15], various defects were induced into DLC films during PVD (Physical Vapor Deposition) and CVD processes. In the present study, MF-PECVD was utilized to synthesize the thick DLC film with much less amount of defects [13][14]. To demonstrate the homogeneity of MF-PECVD DLC coating, the coating process under the pressures of 2.5 Pa and 3 Pa was stopped to prepare each growing DLC films for hardness testing.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…As stated in [15], various defects were induced into DLC films during PVD (Physical Vapor Deposition) and CVD processes. In the present study, MF-PECVD was utilized to synthesize the thick DLC film with much less amount of defects [13][14]. To demonstrate the homogeneity of MF-PECVD DLC coating, the coating process under the pressures of 2.5 Pa and 3 Pa was stopped to prepare each growing DLC films for hardness testing.…”
Section: Resultsmentioning
confidence: 99%
“…Die and work materials. A SKD11 substrate with 100 mm x 100 mm was DLC-coated by Medium Frequency (MF) -Plasma Enhanced Chemical Vapor Deposition (PECVD) method as reported in [13][14]. The DLC-coating die was cut from this mother plate and finished to a die shape.…”
Section: Methodsmentioning
confidence: 99%
“…As discussed in [5][6][7][8], the graphene solid with higher thermal conductivity than copper was utilized as a thermal spreader from the GaN chips to the substrate in order to preserve the integrity of semiconductor packages. In this heat transportation design, higher thermal conductivity than 1000 W/K was fully utilized for fast and homogeneous thermal spreading to prevent the GaN-chipped package from thermal damages.…”
Section: Introductionmentioning
confidence: 99%
“…Diamond-like carbon (DLC) coatings have widespread industrial applications for their low friction coefficient [1][2][3][4], corrosion-resistance [5][6][7], biocompatibility [8], high hardness [9], chemical inertness [10][11][12][13][14][15], surface functionality [16], etc. However, the coatings suffer failures on substrates, mostly due to intrinsic stress [17].…”
Section: Introductionmentioning
confidence: 99%