Micro-opto-mechanical vibration sensor integrated on silicon

Ollier, E.; Philippe, P.; Chabrol, C.; Mottier, P.

doi:10.1109/50.737417

Cited by 21 publications

(12 citation statements)

References 8 publications

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“…Even in planar circuits limitations arise, for example, for the realization of polarization control [31][32][33][34][35][36] or for the implementation of free-standing structures required for tunable 37,38 and optomechanical applications. [39][40][41] Therefore, advanced lithography techniques that provide access to truly 3D geometries are of particular interest. Among the available options direct laser writing (DLW) 42 is especially attractive for the combination with planar circuits because of direct fabrication compatibility.…”

Section: Introductionmentioning

confidence: 99%

Hybrid 2D–3D optical devices for integrated optics by direct laser writing

Schumann

Bückmann

Gruhler³

et al. 2014

Light Sci Appl

151

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Integrated optical chips have already been established for application in optical communication. They also offer interesting future perspectives for integrated quantum optics on a chip. At present, however, they are mostly fabricated using essentially planar fabrication approaches like electron-beam lithography or UV optical lithography. Many further design options would arise if one had complete fabrication freedom in regard to the third dimension normal to the chip without having to give up the virtues and the know-how of existing planar fabrication technologies. As a step in this direction, we here use three-dimensional dip-in direct-laser-writing optical lithography to fabricate three-dimensional polymeric functional devices on pre-fabricated planar optical chips containing Si 3 N 4 waveguides as well as grating couplers made by standard electron-beam lithography. The first example is a polymeric dielectric rectangular-shaped waveguide which is connected to Si 3 N 4 waveguides and that is adiabatically twisted along its axis to achieve geometrical rotation of linear polarization on the chip. The rotator's broadband performance at around 1550 nm wavelength is verified by polarization-dependent grating couplers. Such polarization rotation on the optical chip cannot easily be achieved by other means. The second example is a whispering-gallery-mode optical resonator connected to Si 3 N 4 waveguides on the chip via polymeric waveguides. By mechanically connecting the latter to the disk, we can control the coupling to the resonator and, at the same time, guarantee mechanical stability of the three-dimensional architecture on the chip.

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Section: Introductionmentioning

confidence: 99%

Hybrid 2D–3D optical devices for integrated optics by direct laser writing

Schumann

Bückmann

Gruhler³

et al. 2014

Light Sci Appl

151

View full text Add to dashboard Cite

show abstract

“…Due to the remarkable development of silicon micromachining technology in the past decade, integrated optic sensors incorporated with micromechanical structures on silicon substrates have attracted much attention [1,2]. Several groups have demonstrated integrated-optic interferometric pressure sensors with micromachined diaphragms [3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Silicon-Based Integrated Optic Pressure Sensor Using Intermodal Interference between TM-Like and TE-Like Modes

Ohkawa¹,

Shirai²,

Goto³

et al. 2002

Fiber and Integrated Optics

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In this paper, a silicon-based integrated optic pressure sensor using an intermodal interference between the fundamental TM-like and TE-like modes is described. The sensor consists of a micromachined rectangular diaphragm and a straight polystyrene optical waveguide passing over the diaphragm. Its sensitivity is theoretically known to be strongly dependent on the position of the waveguide over the diaphragm. To experimentally investigate such dependence, we fabricated a sensor with a 1.2 mm1 0 mm´20 m diaphragm, over which waveguides were placed at 50 m intervals. The measured phase sensitivity was 98 mrad/kPa for the waveguide nearest to the diaphragm edge. The measurement was also carried out for the other waveguides. As theoretically expected, the largest sensitivity was obtained for the waveguide nearest to the edge.

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“…The early successes in MEMS technology were in the area of physical sensors, and more specifically in sensing the motion of a suspended proof mass for acceleration [24], rotation (e.g., MEMS micro-gyroscope, Fig. 2) [25,23], and vibration measurements [26,27]. Another early application was the measurement of ambient pressure, which was achieved by monitoring the deflection of microfabricated membranes [28].…”

Section: Mems: An Ideal Candidate For Tier-scalable Reconnaissancementioning

confidence: 99%

Tier-scalable reconnaissance: the challenge of sensor optimization, sensor deployment, sensor fusion, and sensor interoperability

Fink

George²,

Tarbell

2007

SPIE Proceedings

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Robotic reconnaissance operations are called for in extreme environments, not only those such as space, including planetary atmospheres, surfaces, and subsurfaces, but also in potentially hazardous or inaccessible operational areas on Earth, such as mine fields, battlefield environments, enemy occupied territories, terrorist infiltrated environments, or areas that have been exposed to biochemical agents or radiation. Real time reconnaissance enables the identification and characterization of transient events. A fundamentally new mission concept for tier-scalable reconnaissance of operational areas, originated by Fink et al., is aimed at replacing the engineering and safety constrained mission designs of the past. The tier-scalable paradigm integrates multi-tier (orbit atmosphere surface/subsurface) and multi-agent (satellite UAV/blimp surface/subsurface sensing platforms) hierarchical mission architectures, introducing not only mission redundancy and safety, but also enabling and optimizing intelligent, less constrained, and distributed reconnaissance in real time. Given the mass, size, and power constraints faced by such a multi-platform approach, this is an ideal application scenario for a diverse set of MEMS sensors. To support such mission architectures, a high degree of operational autonomy is required. Essential elements of such operational autonomy are: (1) automatic mapping of an operational area from different vantage points (including vehicle health monitoring); (2) automatic feature extraction and target/region-of-interest identification within the mapped operational area; and (3) automatic target prioritization for close-up examination. These requirements imply the optimal deployment of MEMS sensors and sensor platforms, sensor fusion, and sensor interoperability.

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Micro-opto-mechanical vibration sensor integrated on silicon

Cited by 21 publications

References 8 publications

Hybrid 2D–3D optical devices for integrated optics by direct laser writing

Hybrid 2D–3D optical devices for integrated optics by direct laser writing

Silicon-Based Integrated Optic Pressure Sensor Using Intermodal Interference between TM-Like and TE-Like Modes

Tier-scalable reconnaissance: the challenge of sensor optimization, sensor deployment, sensor fusion, and sensor interoperability

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