2014
DOI: 10.1038/lsa.2014.56
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Hybrid 2D–3D optical devices for integrated optics by direct laser writing

Abstract: Integrated optical chips have already been established for application in optical communication. They also offer interesting future perspectives for integrated quantum optics on a chip. At present, however, they are mostly fabricated using essentially planar fabrication approaches like electron-beam lithography or UV optical lithography. Many further design options would arise if one had complete fabrication freedom in regard to the third dimension normal to the chip without having to give up the virtues and t… Show more

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Cited by 151 publications
(73 citation statements)
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References 60 publications
(57 reference statements)
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“…For instance, it is noted by Yoon [28] that insertion loss of multimode polymer waveguide is significantly influenced by the sidewall roughness and the insertion loss decreases linearly as surface roughness improves. However, here the overall effect of surface roughness on the insertion loss of the fabricated waveguides was not investigated [29][30][31]. Moreover relevant experimental dataset pertaining to effect of sidewall roughness along with considered parameters was not available for GRA.…”
Section: Discussionmentioning
confidence: 95%
“…For instance, it is noted by Yoon [28] that insertion loss of multimode polymer waveguide is significantly influenced by the sidewall roughness and the insertion loss decreases linearly as surface roughness improves. However, here the overall effect of surface roughness on the insertion loss of the fabricated waveguides was not investigated [29][30][31]. Moreover relevant experimental dataset pertaining to effect of sidewall roughness along with considered parameters was not available for GRA.…”
Section: Discussionmentioning
confidence: 95%
“…10 The SPP is fabricated utilizing direct laser writing of polymers (Photonic Professional GT with IP-Dip photoresist, nanoscribe GmbH, Germany) in dip-in configuration to enable integration directly on the surface of the finished MEMS device. First, the chip is fully covered by the liquid dip-in photoresist.…”
Section: Device Structure and Fabricationmentioning
confidence: 99%
“…This allows fundamentally unlimited integration and packaging of diverse functional microdevices. [42][43][44][45][46][47][48][49][50] It should be mentioned that such structures can serve as 3D templates for infiltration of another media with desired properties which cannot be nanofabricated in 3D by DLW. [51][52][53] Lastly, usage of ultrashort pulses enables avoidance of photosensitization [54][55][56] which is an arising issue and might be limiting factor to optical and biological applications due to its light absorption and toxicity.…”
Section: Introductionmentioning
confidence: 99%