Micro-Jet Arrays for Cooling of Electronic Equipment

Overholt, Matthew R.; McCandless, Andrew; Kelly, Kevin W.; Becnel, Charles; Motakef, Shariar

doi:10.1115/icmm2005-75250

Cited by 23 publications

(10 citation statements)

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“…The experimental study was carried out by (Overholt et al, 2005) to study the performance and usage of Microjet Cooling Jet Arrays (MCJA) in electronic components. It consists of jet arrays of small diameter (300 Microns) used for removal of higher heat fluxes from 300 -1000 W/cm 2 .…”

Section: Experimental Techniquesmentioning

confidence: 99%

A Review on Cooling of Discrete Heated Modules Using Liquid Jet Impingement

Hotta¹,

Patil²

2018

Frontiers in Heat and Mass Transfer

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The manuscript deals with the critical review for cooling of discrete heated electronic components using liquid jet impingement. Cooling of electronic components has been a lead area of research in recent years. Due to the rapid growth of electronic industries, there is an enormous rise in the system power consumption, and the reduction in the size of electronic components has led to a rapid increase in the heat dissipation rate per unit volume of components. The present paper deals with the role of liquid jet impingement (heat flux removal rate 200-600 W/cm 2) for cooling of electronic components. The type of working fluids (Water / Fluorocarbon liquids / Dielectric fluids / Nanofluids) used for cooling, mode of heat transfer (Natural / Forced / Mixed) from electronic components, and the method of analysis (Experimental / Numerical / Combination of both) greatly influence the cooling mechanism. The electronic components considered in the present study are limited to microelectronic chips, VLSI circuit chips, integrated circuits (IC) chips and resistors. Most of the literature is pertinent to cooling of square heat sources, and many of the researchers have also focused on the comparative studies using different working fluids. Results suggest that Fluorocarbon liquids can be used for higher heat flux removal due to their high boiling point. The temperature drop obtained from the electronic components using liquid jet impingement was found to be in the range of 80-85ºC.

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Section: Experimental Techniquesmentioning

confidence: 99%

A Review on Cooling of Discrete Heated Modules Using Liquid Jet Impingement

Hotta¹,

Patil²

2018

Frontiers in Heat and Mass Transfer

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“…Forced Air Convection, (Heat Sink with a fan) 0.001-0.025 35 (Mudawar, 2001) Single Phase Natural Convection with FC 0.1 0.1-3 (Anderson et al, 1989) Single Phase Natural Convection with water 0.08-0.2 5-90 (Mudawar, 2001) Two Phase Heat Pipes (water) -NA-250 (Zuo et al, 2001) Single Phase Micro-channel - NA-790 (Tukerman et al, 1981) Electrical Peltier Cooler -NA-125 (Riffat et al, 2004) Two phase Pool boiling with porous media 3.7 140 (Rainey et al, 2003a ) Two Phase Sub-cooled Flow Boiling 2 129 (Sturgis and Mudawar, 1999) Two Phase Micro-channel Boiling 10-20 275 (Faulkner et al, 2003) Two Phase Spray Cooling 20-40 1200 (Pais et al, 1992) Two Phase Jet Impingement 28 1820 (Overholt et al, 2005) (Glassman, 2005) 1.2 Major application areas of spray cooling Spray cooling utilises a spray of small droplets impinging on a heated surface to increase the effectiveness of heat transfer as a cooling mechanism with phase change (Incropera and Dewitt, 2002). Spray cooling is widely used in various fields: fire protection, cooling of hot gases, dermatological operation and cooling of hot surfaces including hot strip mill and high performance electronic devices.…”

Section: Mechanismmentioning

confidence: 99%

Spray Cooling

Yan¹,

Zhao²,

Duan³

et al. 2011

Two Phase Flow, Phase Change and Numerical Modeling

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“…Heat Flux Single phase flow in microchannels (Pijnenberg et al [5]) 450 W/cm 2 (at T=85 o C with DI water and silicon microchannels) Single phase flow in porous media (Hetsroni et al. [6]) 416 W/cm 2 (at T=85 o C with stainless-steel sintered particles) Single phase, multi-jet impingement cooling (Overholt et al [7]) 471 W/cm 2 (at T=85 o C with DI water)…”

Section: Introductionmentioning

confidence: 99%

Experimental characterization of a micro-scale thin film evaporative cooling device

Narayanan

Fedorov

Joshi

2010

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

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A MEMS-NEMS cooling device based on gas-assisted, thinfilm evaporation and its experimental performance characterization are presented, aiming to dissipate large heat fluxes at low junction temperature for thermal management of hot spots in microprocessors. The salient feature of this cooling scheme that distinguishes it from other currently used microfluidic cooling techniques is an efficient combination of heat and mass transfer modes to maximize the rate of convective heat transfer and phase change via evaporation, which enable dissipation of very large heat fluxes. In order to make this possible, a thin film of coolant (~15 Pm) is maintained by capillary action over the hotspot by using a thin (~ 10 Pm) nanoporous membrane. This results in minimizing the thermal resistance offered by the thin film. In addition, jet impingement of dry air over the membrane enhances evaporation rate by reducing the mass transfer resistance for transport of vapor phase from the liquid-vapor interface to the ambient. In this paper, design and performance results obtained from experimental testing of a microfabricated device are discussed, demonstrating the heat transfer coefficients approaching 0.1 MW/m 2 K, while maintaining surface temperatures well below the saturation temperature of the working fluid. A Area, m 2 p C Specific heat, J/kgK h Heat transfer coefficient, W/m 2 K hc Mass transfer coefficient, m/s h Enthalpy, J/kg I Current, A k Thermal conductivity, W/mK A Characteristic length scale, m m Mass flow rate, kg/s Nu Nusselt number p Absolute pressure, Pa q Rate of heat dissipation, W qcc Heat flux, W/m 2 R Specific gas constant, J/kgK R Thermal resistance, K/W Rc Electrical resistance, T Temperature, K u Velocity, m/s V Potential difference, V Greek symbols G Substrate's thickness, m f Natural convection and ambient conditions U Density, kg/m 3

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Micro-Jet Arrays for Cooling of Electronic Equipment

Cited by 23 publications

References 0 publications

A Review on Cooling of Discrete Heated Modules Using Liquid Jet Impingement

A Review on Cooling of Discrete Heated Modules Using Liquid Jet Impingement

Spray Cooling

Experimental characterization of a micro-scale thin film evaporative cooling device

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