The manuscript deals with the critical review for cooling of discrete heated electronic components using liquid jet impingement. Cooling of electronic components has been a lead area of research in recent years. Due to the rapid growth of electronic industries, there is an enormous rise in the system power consumption, and the reduction in the size of electronic components has led to a rapid increase in the heat dissipation rate per unit volume of components. The present paper deals with the role of liquid jet impingement (heat flux removal rate 200-600 W/cm 2) for cooling of electronic components. The type of working fluids (Water / Fluorocarbon liquids / Dielectric fluids / Nanofluids) used for cooling, mode of heat transfer (Natural / Forced / Mixed) from electronic components, and the method of analysis (Experimental / Numerical / Combination of both) greatly influence the cooling mechanism. The electronic components considered in the present study are limited to microelectronic chips, VLSI circuit chips, integrated circuits (IC) chips and resistors. Most of the literature is pertinent to cooling of square heat sources, and many of the researchers have also focused on the comparative studies using different working fluids. Results suggest that Fluorocarbon liquids can be used for higher heat flux removal due to their high boiling point. The temperature drop obtained from the electronic components using liquid jet impingement was found to be in the range of 80-85ºC.

Electric vehicles are important in today’s world to reduce pollution. The demand for electric vehicles is increasing day by day. The major component is the battery for an electric vehicle which gives the power to drive motor and drives the vehicle. Continuous operation of the vehicle causes the battery to heat and while heating there are some flammable gases released which may cause a fire. The heating of batteries reduces the performance of the vehicle and reduces the efficiency, therefore there is a need for cooling techniques to keep the temperature of batteries below the critical temperature for safe operating conditions. The present study emphasizes various cooling techniques used for the battery thermal management system. Cooling improves the performance of the battery and reduces the temperature of the battery. It helps in maintaining the temperature of the battery at the desired level. Before cooling the battery, it is necessary to study the thermal behavior of the battery. Various aspects of the thermal behavior are also reported in the paper and the problems associated with the time required for charging the batteries are also discussed.

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The current study deals with the numerical investigation of the substrate board characteristics using different materials (FR4, silicon cladding and copper cladding) on which nine nonidentical electronic components (ECs) are mounted, which are supplied with nonuniform heat flux. The study is conducted for natural and forced convection (3[Formula: see text]m/s and 5[Formula: see text]m/s) modes of heat transfer. It is observed that for 5[Formula: see text]m/s the temperature of the ECs is dropped by 30–47∘C using copper cladding board in comparison to FR4 and silicon cladding board. It is also noted that with the use of copper cladding board the velocity of air required for cooling the ECs is substantially reduced by 2[Formula: see text]m/s and the temperature of the IC chip is reduced by 1.50–11.12∘C.

This paper deals with the experimental and numerical investigations of 7 IC chips cooled using the water flowing inside the cold plate at different flow rates. The present study includes the supply of three different cases heat input values under four different flow rates (0.063 kg/s, 0.125 kg/s, 0.25 kg/s and 0.5 kg/s) to cool the high heat generating IC chips mounted on the SMPS at various positions. The optimal configuration (71-11-74-76-65-24-15) for the arrangement of the 7 IC chips is considered for the analysis. The numerical simulations are carried out using the commercial software ANSYS FLUENT (R-16) and the results are validated with the experiments. Both the results agree with each other in the error band of 8 - 14 % for the IC chip temperature. The smallest chip U6 attains the maximum temperature, as the heat attenuation rate for this chip is very high. By increasing the water flow rates, the heat absorbed by the chips is high and cools these faster. A correlation is proposed for the Nusselt number of the chips with the Reynolds number of the flow. The results suggest that the liquid cold plate plays a vital role in the cooling of the IC chips and leads to better thermal management.