Method of Shock Test for Micro Joints of Mobile Equipments

Ido, Osamu; Nagatake, Mami; Itoh, Nobutaka; Mishiro, Kinuko; Hiroshima, Yoshiyuki

doi:10.1299/jsmezairiki.2000.0_529

Cited by 3 publications

(1 citation statement)

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“…Drop tests of the substrate on which a package is mounted (11), (12) and steel ball drop tests (13) which generate an impact strain in the substrate are commonly used to evaluate impact strength of a solder joint. For this study, the cyclic impact bending test was used as shown in Fig.…”

Section: Cyclic Impact Bending Testmentioning

confidence: 99%

Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device

Nagano

Yaguchi

Terasaki

2006

JSME Int. J., Ser. A

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Solder joints between a package and a printed wiring board (PWB) of a portable electronic device sustain heat cycling as a result of power on-off operations, cyclic bending by key pad operation, and impact bending by dropping. Therefore, heat cycling, cyclic bending, and cyclic impact bending tests were conducted on the ball grid array solder joints between a chip scale package and a PWB. The evaluated solders were Sn-3Ag-0.5Cu and Sn-37Pb. The tests showed that the life cycles of the Sn-3Ag-0.5Cu solder joints for the heat cycling and cyclic bending tests were approximately twice those of the Sn-37Pb solder joints. For the cyclic impact bending test, however, the life cycle of the Sn-3Ag-0.5Cu joint under large strain was smaller than that of the Sn-37Pb solder joint because of interfacial crack growth between the solder and the PWB. Finally, fatigue lives of the joints were compared with crack initiation and failure lives of plain specimens by calculating local strain ranges in the joints by elastic-plastic finite element analysis.

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Section: Cyclic Impact Bending Testmentioning

confidence: 99%

Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device

Nagano

Yaguchi

Terasaki

2006

JSME Int. J., Ser. A

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High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

Wong

Seah

Selvanayagam

et al. 2009

Journal of Elec Materi

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This paper presents a comprehensive study of the resistance of solder joints to failure when subjected to strain rates that simulate the conditions of drop impact experienced by a portable electronic product. Two test methods are used in this study: the board-level drop-shock test (BLDST) and the boardlevel high-speed cyclic bend test (HSCBT). The performance of (i) 12 material combinations consisting of six solder alloys and two pad finishes, and (ii) 11 manufacturing variations covering three vendors, two finishes, three immersion gold thicknesses, and three thermal aging conditions were investigated using these two test methods. Correlations between the two test methods were performed. Quantitative correlation and sensitivity coefficients for the failure modes and the measured characteristic parameters-number of drops to failure for BLDST and number of cycles to failure for HSCBT-were evaluated. Finally, the potential of HSCBT as a test method for material selection and for bridging board-level and product-level tests was demonstrated through generation of board strain versus number of cycles to failure (S-N) curves of solder joints for six material systems, four bending frequencies, and two test temperatures.

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Correlation studies for component level ball impact shear test and board level drop test

Wong

Rajoo

Seah

et al. 2008

Microelectronics Reliability

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Method of Shock Test for Micro Joints of Mobile Equipments

Cited by 3 publications

References 0 publications

Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device

Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

Correlation studies for component level ball impact shear test and board level drop test

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