Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device

Nagano, Kohta; Yaguchi, Akihiro; Terasaki, Takeshi

doi:10.1299/jsmea.49.220

Cited by 10 publications

(1 citation statement)

References 8 publications

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“…extensive thermal aging [12]. In recent years, a significant number of studies have Board-level tests, on the other hand, allow realistic loading addressed the issue of drop impact failure of solder joints, conditions to be applied to the solder joint, but require more [14][15], who used a tester which properties. applied direct impacts to the PCB using a falling mass.…”

Section: Introductionmentioning

confidence: 99%

A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests

Seah

Wong

Selvanayagam³

et al. 2008

2008 10th Electronics Packaging Technology Conference

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devices, it is also very useful to be able to estimate the life of Due to rapid and continual changes in the components and solder joints under actual usage conditions designs of portable electronic devices, it is essential to have Test methods for assessing the drop impact reliability of the ability to perform quick, cost-effective and accurate solder joints are commonly performed at either the component assessments of the drop impact performance of component level or the board level. In component-level tests -typically interconnections for portable applications. In order to ball shear -loads are applied directly to the solder bumps understand the phenomena of solder joint fatigue under mounted on a package substrate. In board-level tests, loads are impact-induced PCB bending, a tester was developed applied directly to a PCB assembly, which indirectly induces specifically for applying high bending strains at high strain stresses in the solder joints between the component and the rates to a PCB assembly. Fatigue characteristics of solder PCB. joints were determined for various PCB strains, allowing the Much effort has been dedicated to developing a construction of fatigue E-N (strain vs. cycles-to-failure) component-level test method which can assess drop impact curves. Fatigue data was also generated for several bending performance. The earliest reported work on component-level frequencies in a study of the effect of strain rate on drop testing was by Shoji et. al.[6] who used a miniature pendulum impact performance. Higher bending frequencies were found tester to determine the fracture energy of solder joints under to reduce fatigue life. A comprehensive test method would high-speed shear. Since then, more sophisticated tools for also have to be capable of applying variable loading levels in high-speed ball shear have been developed, including order to replicate the complex loading spectrums seen in pendulum testing [8], drop shear [9], and motorized or springactual product drops. A variable amplitude study is presented, driven shear with force/displacement measurement [10-1 1].where crack propagation tracking shows the effect of changes High-speed ball pull studies have also been performed, to a in load levels on the crack growth rate. Finally, a study on the lesser degree [10]. The majority of component-level studies effect of low temperatures on drop impact reliability is have focused on a qualitative approach of correlating shear presented, where fatigue characteristics were obtained using failure modes (e.g. brittle or ductile fracture) with board-level the bend tester fitted with a cold temperature chamber.drop impact performance. However, quantitative measurements of shear fracture strength and fracture energy Introduction were reported to be insensitive to drop impact performance As portable electronic devices (e.g. mobile phones, MP3 [12]. Difficulties in quantitative correlations are due to 1) players) are susceptible to accidental drops in everydaybuse, an significant differences in the solder joint ...

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Section: Introductionmentioning

confidence: 99%

A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests

Seah

Wong

Selvanayagam³

et al. 2008

2008 10th Electronics Packaging Technology Conference

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Reliability Study of Solder Joints in Electronic Packaging Technology

Sharif

Majumder

2019

Harsh Environment Electronics

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High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

Wong

Seah

Selvanayagam

et al. 2009

Journal of Elec Materi

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This paper presents a comprehensive study of the resistance of solder joints to failure when subjected to strain rates that simulate the conditions of drop impact experienced by a portable electronic product. Two test methods are used in this study: the board-level drop-shock test (BLDST) and the boardlevel high-speed cyclic bend test (HSCBT). The performance of (i) 12 material combinations consisting of six solder alloys and two pad finishes, and (ii) 11 manufacturing variations covering three vendors, two finishes, three immersion gold thicknesses, and three thermal aging conditions were investigated using these two test methods. Correlations between the two test methods were performed. Quantitative correlation and sensitivity coefficients for the failure modes and the measured characteristic parameters-number of drops to failure for BLDST and number of cycles to failure for HSCBT-were evaluated. Finally, the potential of HSCBT as a test method for material selection and for bridging board-level and product-level tests was demonstrated through generation of board strain versus number of cycles to failure (S-N) curves of solder joints for six material systems, four bending frequencies, and two test temperatures.

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Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device

Cited by 10 publications

References 8 publications

A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests

A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests

Reliability Study of Solder Joints in Electronic Packaging Technology

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

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