Metallization Corrosion in Silicon Devices by Moisture-Induced Electrolysis

Corrosion of Aluminum Metallization Through Flawed Polymer Passivation Layers; In-Situ Microscopy

“…Al Al+++ + 3e E [12] 3H + 3e = 3/2H2, [13] and the chemical dissolution reaction by summation is Al + 3H -AlH± + 3/2 H2. [14] Reactions at Negative Metallization: With application of a bias, H2 will be evolved at the negative Al track which will make the originally near-neutral solution alkaline, according to Eq.…”

An investigation of the impact of a Ti barrier metal on the thermal stress field in passivated aluminium lines and vias in VLSI systems using finite element modelling approach

“…As a result, reliability problems increasingly become associated with the metal lines rather than the active devices. The inherent lack of reliability may result from corrosion (Koelmans 1974, Comizzoli 1976, Wada et al 1986), electromigration (Black 1969, Ghate 1983, Fischer and Neppl 1984 or the stress-migration phenomenon (Curry et al 1984, Klema et al 1984, Hinode et al 1990, Korhonen et al 1991, Kusaka et al 1996. The last of these, stress-migration, is fast becoming the dominant failure mechanism, especially as metal line widths reach submicron dimensions.…”

Unique Observations on Moisture Analysis: "Consumer" and Analyst

“…3 Need for general gas analysis capability. 2. Need for information on species besides moisture, as a result of studies on effects of H2 and 02 on moisture levels.…”

“…Need for information on species besides moisture, as a result of studies on effects of H2 and 02 on moisture levels. 2 3. Some difficulties in routine use of the moisture sensor in metal parts.…”