An investigation of the impact of a Ti barrier metal on the thermal stress field in passivated aluminium lines and vias in VLSI systems using finite element modelling approach

Abstract

To cite this article: P. M. Igic & P. A. Mawby (2000) An investigation of the impact of a Ti barrier metal on the thermal stress field in passivated aluminium lines and vias in VLSI systems using finite element modelling approach, InternationalThe impact of a thin titanium barrier layer on the residual thermal stress in passivated aluminium lines and vias during the manufacture of multilevel structures is investigated using an advanced ® nite element approach. It is con® rmed that the titanium signi® cantly improves the reliability of the aluminium metallization, since, though the residual stress may be higher, the resulting plastic deformation is still lower.