“…The values (0.5 & 0.1) and (1.9 0.1) eV found from our time of failure studies for the activation energies for electromigration in Sn and I n thin film, respectively, are in fairly good agreement with those found from tracer studies on the same metal thin films, vie., 0.40 [6, 71 and 2.00 eV [a], respectively. I n the case of I n there is a large difference between the activation energy for electromigration (1.9 eV) and for bulk diffusion (0.8 eV [S]) or for grain-boundary diffusion (0.6 eV [4,5]). The activation energies in Sn are 1.1 eV for bulk diffusion and 0.46 eV for grain-boundary diffusion [6, 71.…”