MEMS-based sensors for post-earthquake damage assessment

Pozzi, Matteo; Zonta, Daniele; Trapani, Davide; Αθανασόπουλος, Νικόλαος; Amditis, Angelos; Bimpas, Matthaios; Garetsos, A.; Stratakos, Yorgos; Ulieru, Dumitru Gh.

doi:10.1088/1742-6596/305/1/012100

Cited by 15 publications

(9 citation statements)

References 5 publications

(4 reference statements)

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“…Several recent projects encompass the realization of prototypes of MEMS-based (mainly accelerometers and gyroscopes) monitoring station specifically designed for SHM: they are based on the measure of the structural vibration, from which structural health and post-event (e.g., earthquake) damage can be diagnosed [22,23,61,92,93,94,95,96,97,98,99]. Other studies also investigated the possibility to use the MEMS accelerometers integrated within the smartphones to develop citizen-engaging networks for SHM, like the ones created for earthquake observation and EEW [30,62,100,101].…”

Section: Application Of Capacitive Mems Accelerometers To Seismologymentioning

confidence: 99%

A Review of the Capacitive MEMS for Seismology

D’Alessandro

Scudero

Vitale

2019

Sensors

104

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MEMS (Micro Electro-Mechanical Systems) sensors enable a vast range of applications: among others, the use of MEMS accelerometers for seismology related applications has been emerging considerably in the last decade. In this paper, we provide a comprehensive review of the capacitive MEMS accelerometers: from the physical functioning principles, to the details of the technical precautions, and to the manufacturing procedures. We introduce the applications within seismology and earth sciences related disciplines, namely: earthquake observation and seismological studies, seismic surveying and imaging, structural health monitoring of buildings. Moreover, we describe how the use of the miniaturized technologies is revolutionizing these fields and we present some cutting edge applications that, in the very last years, are taking advantage from the use of MEMS sensors, such as rotational seismology and gravity measurements. In a ten-year outlook, the capability of MEMS sensors will certainly improve through the optimization of existing technologies, the development of new materials, and the implementation of innovative production processes. In particular, the next generation of MEMS seismometers could be capable of reaching a noise floor under the lower seismic noise (few tenths of ng/ H z ) and expanding the bandwidth towards lower frequencies (∼0.01 Hz).

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Section: Application Of Capacitive Mems Accelerometers To Seismologymentioning

confidence: 99%

A Review of the Capacitive MEMS for Seismology

D’Alessandro

Scudero

Vitale

2019

Sensors

104

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“…Micro‐electromechanical systems can be equipped with integrated circuits and act as intelligent sensors, actuators, or both (e.g., ). More importantly, MEMS can be embedded into structures for subsurface crack detection.…”

Section: Emerging Monitoring Technologies and Future Trendsmentioning

confidence: 99%

“…Recently, strain sensors were also developed with MEMS (e.g. ). Although low‐cost MEMS are emerging, the need for special processing steps implies increased costs.…”

Section: Emerging Monitoring Technologies and Future Trendsmentioning

confidence: 99%

Crack detection and characterization techniques-An overview

Yao

Tung

Glišić

2014

Struct. Control Health Monit.

208

123

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SUMMARY Crack occurrence and propagation are among critical factors that affect the performance and lifespan of civil infrastructures such as bridges, pipelines, and so on. As a consequence, numerous crack detection and characterization techniques have been researched and developed in the past decades in the areas of SHM and non‐destructive evaluation (NDE). The significant amount of performed studies and the large number of publications give rise to the need to systematize, condensate, and summarize this enormous effort. The aims of this paper are to summarize the knowledge about cracking and its sources, review both existing and emerging methods for crack detection and characterization, and identify the advantages and challenges for these methods. In general, this paper identifies two sensing approaches (direct and indirect) and two data analysis approaches (model‐based and model‐free or data‐driven) along with a range of associated technologies. The advantages and challenges of each approach and technology are discussed and summarized, and the future research needs are identified. This paper is intended to serve as a reference for researchers who are interested in crack detection and characterization as well as for those who are generally interested in SHM and NDE. Copyright © 2014 John Wiley & Sons, Ltd.

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“…The most commonly used techniques are based on mechanical voltage sensors (electric or fiber optics [1]), piezoelectric and acoustic sensors (acoustic emission and wave propagation control [2]), and accelerometers. New approaches include Micro Electrochemical Systems (MEMS) [3,4], piezoelectric paints, Large Area Electronics (LAE), and contactless laser techniques. Nonetheless, there are several algorithmic data analysis methods combined with sensor techniques for the detection and characterization of cracks [5].…”

Section: Introductionmentioning

confidence: 99%

Contactless Detection of Natural Bending Frequencies using Embedded Metallic-Glass Ribbons inside Plastic Beams made of 3-D Printing

Kouzoudis¹,

Samourgkanidis²,

Tapeinos³

2020

RPM

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In the current work, to identify the bending mode harmonics, 30 microns thin magnetoelastic ribbons made of metallic glass are embedded inside 6 mm thick PLA plastic cantilever beams made by 3-D printing. This is possible because the ribbons are of magnetoelastic nature and thus change their mechanical state inducing a corresponding change in their magnetic state. The ribbons are placed at four different depths, starting with zero depth at the beam’s external surface all the way inside to the beam’s mid-plane. This technique is capable of detecting seven harmonics, and remarkably, these frequencies remain the same within a marginal error of 1% for all the depths. The amplitude of the modes drops with the increase in depth but is still strong enough, except at the midplane, to be used as a sensing signal. The harmonics spectrum is the unique signature of the structure’s state; this is a proof of concept that in a contactless fashion, the embedded ribbons provide useful information about the mechanical health of a structure.

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MEMS-based sensors for post-earthquake damage assessment

Abstract: View the article online for updates and enhancements.

Cited by 15 publications

References 5 publications

A Review of the Capacitive MEMS for Seismology

A Review of the Capacitive MEMS for Seismology

Crack detection and characterization techniques-An overview

Contactless Detection of Natural Bending Frequencies using Embedded Metallic-Glass Ribbons inside Plastic Beams made of 3-D Printing

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