2011 Sixteenth IEEE European Test Symposium 2011
DOI: 10.1109/ets.2011.11
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Memory Test Optimization for Parasitic Bit Line Coupling in SRAMs

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“…Also, variations in other device parameters, such as variations in wafer size, gate oxide thickness, channel length, feature size, capacitive coupling among signals, and power lines have a huge impact on the memory cell and other parts of memory. Recently, it has been proven that the Bit line coupling capacitance (CC BL ) develops undesired voltage coupling on adjacent memory cells belonging to the same world line, which can have an impact on the sense amplifier operation when reading data from the SRAM [1].…”
Section: Introductionmentioning
confidence: 99%
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“…Also, variations in other device parameters, such as variations in wafer size, gate oxide thickness, channel length, feature size, capacitive coupling among signals, and power lines have a huge impact on the memory cell and other parts of memory. Recently, it has been proven that the Bit line coupling capacitance (CC BL ) develops undesired voltage coupling on adjacent memory cells belonging to the same world line, which can have an impact on the sense amplifier operation when reading data from the SRAM [1].…”
Section: Introductionmentioning
confidence: 99%
“…To address the above mentioned faults the current research uses a Built-in Self Test (BIST) technique for testing the SRAM memories in a Xilinx Virtex-4 series FPGA. In the field of FPGAs, BIST has been a topic of research and development for the past decade [1][2][3][4][5][6][7][8]. The BIST technique employs a Test Pattern Generator (TPG) which generates the input test pattern to test the Circuit Under Test (CUT).…”
Section: Introductionmentioning
confidence: 99%
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