Meeting the MEMS “Design-to-Analysis” Challenge: The SUMMiT® V Design Tool Environment

Yarberry, Victor R.

doi:10.1115/imece2002-39205

Cited by 11 publications

(6 citation statements)

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“…The silicon structures were fabricated using the SUMMiT-lite process at Sandia, which uses a subset of the layers comprising the full SUMMiT process [9]. A 3-D model cross section of the final structure is shown in Fig.…”

Section: Design and Microfabrication Of Silicon Structurementioning

confidence: 99%

Micromachined Accelerometers With Optical Interferometric Read-Out and Integrated Electrostatic Actuation

Hall

Okandan

Littrell

et al. 2008

J. Microelectromech. Syst.

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A micromachined accelerometer device structure with diffraction-based optical detection and integrated electrostatic actuation is introduced. The sensor consists of a bulk silicon proof mass electrode that moves vertically with respect to a rigid diffraction grating backplate electrode to provide interferometric detection resolution of the proof-mass displacement when illuminated with coherent light. The sensor architecture includes a monolithically integrated electrostatic actuation port that enables the application of precisely controlled broadband forces to the proof mass while the displacement is simultaneously and independently measured optically. This enables several useful features such as dynamic self-characterization and a variety of force-feedback modalities, including alteration of device dynamics in situ. These features are experimentally demonstrated with sensors that have been optoelectronically integrated into sub-cubic-millimeter volumes using an entirely surface-normal, rigid, and robust embodiment incorporating vertical cavity surface emitting lasers and integrated photodetector arrays. In addition to small form factor and high acceleration resolution, the ability to self-characterize and alter device dynamics in situ may be advantageous. This allows periodic calibration and in situ matching of sensor dynamics among an array of accelerometers or seismometers configured in a network.

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Section: Design and Microfabrication Of Silicon Structurementioning

confidence: 99%

Micromachined Accelerometers With Optical Interferometric Read-Out and Integrated Electrostatic Actuation

Hall

Okandan

Littrell

et al. 2008

J. Microelectromech. Syst.

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“…To ensure a consistent design interface and to facilitate successful design implementation, special tools have been developed by SNL to aid in devising of functional designs for successful fabrication in the SUMMiT ® process [53–56].…”

Section: Mems Educationmentioning

confidence: 99%

Progress in Microelectromechanical Systems

Pryputniewicz

2007

Strain

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Recent advances in microelectromechanical systems (MEMS) technology have led to the development of a multitude of new devices heretofore impossible. However, applications of these devices are still hampered by challenges posed by their integration and packaging. The current trend in micro/nanosystems is to produce ever smaller, lighter and more capable devices at a lower cost than ever before. In addition, the finished products have to operate at very low power and in very adverse conditions while ensuring durable and reliable performance. Some of the new devices have been developed to function at high operational speeds, and others to make accurate measurements of operating conditions of specific processes. Regardless of their applications, the devices have to be packaged to facilitate their use. MEMS packaging, however, is application‐specific and, usually, has to be developed on a case‐by‐case basis. To facilitate advances of MEMS, educational programmes have been introduced addressing all aspects in their development. This paper addresses progress in MEMS by presenting pertinent aspects in a development of MEMS including, but not limited to, design, analysis, fabrication, characterisation, packaging, and testing. This presentation is illustrated with selected examples.

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“…For example, an isotropic deposition can cause surfaces to self-intersect and "delooping" these self-intersections is prone to numerical instability. Therefore, this technique can fail for complicated fabrication processes [Varadhan and Manocha 2004;Yarberry 2002]. Moreover, this technique does not yield accurate geometry ] and also suffers from high computational and memory requirements.…”

Section: Introductionmentioning

confidence: 99%

“…The traditional approach to MEMS process geometric modeling [Yarberry 2002] is to perform all the operations using a solid geometry kernel. The large topological changes which occur in the geometry while simulating the fabrication steps make maintenance of the explicit boundary representation difficult.…”

Section: Introductionmentioning

confidence: 99%

Accurate and robust geometric modeling for simulation of IC and MEMS fabrication processes

Udeshi

2005

Proceedings of the 2005 ACM Symposium on Solid and Physical Modeling

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Simulation of IC (Integrated Circuit) and MEMS (Micro Electro Mechanical Systems) fabrication processes offers many interesting challenges. A fabrication step, such as a deposition or an etch, can result in significant changes to the surface profile of the structure. A fabrication process can consist of tens of these steps; therefore, the geometric modeling algorithm must be robust and memory and computationally efficient. Moreover, it should be flexible enough to be able to account for the varied geometric changes that can occur during a step. We describe voxel-based geometric modeling techniques (which exhibit these properties) for accurately modeling different types of deposition and etch steps.

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Meeting the MEMS “Design-to-Analysis” Challenge: The SUMMiT® V Design Tool Environment

Cited by 11 publications

References 0 publications

Micromachined Accelerometers With Optical Interferometric Read-Out and Integrated Electrostatic Actuation

Micromachined Accelerometers With Optical Interferometric Read-Out and Integrated Electrostatic Actuation

Progress in Microelectromechanical Systems

Accurate and robust geometric modeling for simulation of IC and MEMS fabrication processes

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