Moisture Sensitivity of Plastic Packages of IC Devices 2010
DOI: 10.1007/978-1-4419-5719-1_2
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Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds

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Cited by 85 publications
(64 citation statements)
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“…Drying the specimens shifted the crack back to the laminate failure and confirmed swelling as a crucial parameter. The deleterious effects of swelling have also been outlined by other researchers and they are believed to exert additional shear stresses at the interface [152,153].…”
Section: Effect Of Moisture On Adhesively Bonded Jointsmentioning
confidence: 91%
“…Drying the specimens shifted the crack back to the laminate failure and confirmed swelling as a crucial parameter. The deleterious effects of swelling have also been outlined by other researchers and they are believed to exert additional shear stresses at the interface [152,153].…”
Section: Effect Of Moisture On Adhesively Bonded Jointsmentioning
confidence: 91%
“…The desorption process led to much larger diffusion coefficients for the given composite formulations. Microcracks formed in the composites due to fiber swelling and shrinking during absorption and desorption cycle contributed largely to the enlarged diffusion coefficient values in the desorption cycle (Shirangi et al 2008). Among the treated composites, samples with 2% ZnB had the largest Dm (equal to 9.79×10 -4 mm 2 •s -1 ), while samples with 2% AT had the lowest Dm (1.20×10 -4 mm 2 •s -1 ).…”
Section: Final MC and Diffusion Constantmentioning
confidence: 99%
“…However, there are many results reported in the literature showing that at higher temperature-humidity level over long exposure time, moisture diffusion in many epoxy molding compounds exhibit twostage diffusion behavior, and the saturated moisture content may not be repeatable nor reversible, but depends on its prior temperature-humidity exposure history [20,28,46,47]. For example, at IBM showed that moisture absorption-desorption behavior in a epoxy-glass material did not have reversibility but depend on the exposure history [46]: one sample was saturated at 85°C 80% RH first, followed by exposure at 65°C 30% RH; while a second sample was first saturated at 65°C 30% RH, followed by saturation at 85°C 80% RH.…”
Section: Environmental Exposure-induced Increase In C Satmentioning
confidence: 93%
“…Moisture also leads to weakened adhesion strength [19,20] and hygroscopic swelling [21,22], which increases package stresses. For example, the adhesion strength between the solder ball and some underfill materials can decrease by more than 70% upon long time exposure at 85°C and 85%RH [11].…”
Section: Introductionmentioning
confidence: 98%