Mechanism of copper deposition in electroless plating

Ogura, Tetsuya; Malcomson, Mark; Fernaǹdo, Quintus

doi:10.1021/la00101a016

Cited by 16 publications

(8 citation statements)

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“…On contact with the plating solution, metal nanoparticles on the substrate catalyze reduction of the copper ions to metal. 9 Reducing agents used for electroless plating include formaldehyde, [10][11][12] NaBH 4 , 13,14 sodium hypophosphite (NaH 2 PO 2 ), [15][16][17][18][19] glyoxylic acid, 20,21 and amine borane. 22 In our work, inkjet printing droplets of copper citrate and NaBH 4 simultaneously onto paper allows direct reduction on the substrate to form metallic copper lines.…”

Section: Introductionmentioning

confidence: 99%

Conductive copper and nickel lines via reactive inkjet printing

et al. 2009

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Section: Introductionmentioning

confidence: 99%

Conductive copper and nickel lines via reactive inkjet printing

et al. 2009

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“…29 A filter paper (5 cm in diameter) was immersed in a sensitizer solution (50 mL) of SnCl 2 (0.04 M) and HCl (0.5 M) for 1 min, rinsed with deionized water, and then immersed in an activator solution (50 mL) of PdCl 2 (1 mM) and HCl (0.05 M) for 1 min. The filter paper was then rinsed with deionized water.…”

Section: Copper Eld Using Formaldehyde As the Reducing Agentmentioning

confidence: 99%

“…Two ELD reactions were investigated using hydrazine (equation 1) or formaldehyde (equation 2) as the reducing agent. 11,29 The latter reaction uses a tin-and palladium-based activation process.…”

Section: Copper Eld Using Formaldehyde As the Reducing Agentmentioning

confidence: 99%

Surface-initiated growth of copper using isonicotinic acid-functionalized aluminum oxide surfaces

et al. 2016

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Isonicotinate self-assembled monolayers (SAM) were prepared on alumina surfaces (A) using isonicotinic acid (iNA). These functionalized layers (iNA-A) were used for the seeded growth of copper films (Cu-iNA-A) by hydrazine hydrate-initiated electroless deposition. The films were characterized by scanning electron microscopy (SEM), electron-dispersive X-ray spectroscopy, atomic force microscopy, Xray photoelectron spectroscopy, X-ray diffraction, and advancing contact angle measurements. The films are Cu 0 but with surface oxidation, and show a faceted morphology, which is more textured (R q = 460 ± 90 nm) compared to the SAM (R q = 2.8 ± 0.5 nm). In contrast, growth of copper films by SnCl 2 /PdCl 2 catalyzed electroless deposition, using formaldehyde (CH 2 O) as the reducing agent, shows a nodular morphology on top of a relatively smooth surface. No copper films are observed in the absence of the isonicotinate SAM. The binding of Cu 2+ to the iNA is proposed to facilitate reduction to Cu 0 and create the seed for subsequent growth. The films show good adhesion to the functionalized surface.

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“…EDTA was used as a complexing agent acting with Cu ions, and formaldehyde (HCHO) was used as a reducing agent in electroless Cu bath for depositing Cu NPs on the surface of CB. Process attaching Pd catalyst to the surface of CB and composition of electroless Cu plating bath were referred following Fernando's method 23 including temperature and pH. When HCHO is used as reducing agent, reaction formula of Cu deposition is as follows 24…”

Section: Confirmation Of Cu Deposition On Cbmentioning

confidence: 99%

Fabrication of electrically conductive substrates using copper nanoparticles-deposited carbon black

Lim

Lee

Choi³

et al. 2016

Journal of Composite Materials

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Carbon black particles surrounded by copper nanoparticles (Cu NPs) were synthesized using electroless plating method. Palladium chloride was adsorbed onto carbon black, followed by the reduction of palladium chloride for catalyzing the reduction of Cu ions on the surface of carbon black particles. After that, carbon black particles doped by palladium catalyst were dispersed and stirred in Cu plating bath. Cu ions being reduced, Cu NPs surrounded the surface of carbon black particles (Cu@CB). The ratios of Cu to carbon black were controlled through variation of weight of Cu ions in Cu plating bath from 1:1 to 1:7. Cu@CB was applied to electrically conductive substrates with ethyl cellulose binder. Electrical properties and morphology were measured and compared with different weight ratio of Cu and carbon black. It was found that when weight ratio of Cu to carbon black was above three, resistivity of conductive substrates fabricated decreased dramatically. Lowest resistivity was 5.93 × 10−4 Ωcm, confirming the advantages of Cu@CB which has possibility of lowering weight percentage of metal in conductive substrates through simple process.

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Mechanism of copper deposition in electroless plating

Cited by 16 publications

References 0 publications

Conductive copper and nickel lines via reactive inkjet printing

Conductive copper and nickel lines via reactive inkjet printing

Surface-initiated growth of copper using isonicotinic acid-functionalized aluminum oxide surfaces

Fabrication of electrically conductive substrates using copper nanoparticles-deposited carbon black

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