Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test

Cho, Ilje; Ahn, Jin-Ho; Yoon, Jeong‐Won; Shin, Young-Eui; Jung, Seung‐Boo

doi:10.1007/s10854-012-0621-0

Cited by 8 publications

(4 citation statements)

References 14 publications

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“…For a long time, Sn–37Pb eutectic alloy solder has been widely used in the automotive industry, electronic industry and other fields because of its low cost, good mechanical properties, strong conductivity and good processing ability (Cho et al , 2012; Li et al , 2020). However, lead and its compounds are toxic substances, long-term use will bring great harm to the environment (Silva et al , 2022).…”

Section: Introductionmentioning

confidence: 99%

Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures

Lin

et al. 2023

SSMT

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Purpose This study aims to analyze the wettability of the self-developed Sn–Bi–Zn solder and to conduct a series of analysis on the wetting kinetics, diffusion phenomenon and interfacial reaction of Sn–Bi–Zn solder on Cu substrate. Design/methodology/approach The wetting kinetics, diffusion phenomenon and interfacial reaction of Sn–Bi–Zn solder on Cu substrate were analyzed by experiments. The interface was observed by scanning electron microscope to study the effect of Zn content on its interface. Findings With the increase in brazing temperature, the final spreading equivalent radius of the solder increases significantly, and the final contact angle of the solder decreases significantly. In addition, when the Zn content is 1%, the spreading effect of solder is the best, the equivalent radius is the largest and the contact angle is the smallest. According to the microstructural analysis, the thick intermetallic compounds layer of the Sn–15Bi–xZn solders on the Cu substrate can be effectively decreased by adding appropriate Zn content. Originality/value The wetting kinetics, diffusion phenomenon and interfacial reaction of Sn–15Bi–xZn solder on Cu substrate at different temperatures have not been studied yet.

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Section: Introductionmentioning

confidence: 99%

Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures

Lin

et al. 2023

SSMT

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“…A dual Cu–Sn IMCs layer consisting of Cu 6 Sn 5 and Cu 3 Sn can form within solder joints between the Cu substrate and the solder interface. Generally, IMC growth in Sn–Ag–Cu solder joints is more rapid than in eutectic Sn–Pb solder joints due to their higher reflow temperature and significant proportion of Sn [18,19,20]. Thick intermetallic growth degrades the bonding strength due to the brittle nature of the IMC layer and the mismatch in physical properties such as the CTE and elastic modulus.…”

Section: Introductionmentioning

confidence: 99%

Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate

2019

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This study investigated the suppression of the growth of the intermetallic compound (IMC) layer that forms between epoxy solder joints and the substrate in electronic packaging by adding graphene nano-sheets (GNSs) to 96.5Sn–3.0Ag–0.5Cu (wt %, SAC305) solder whose bonding characteristics had been strengthened with a polymer. IMC growth was induced in isothermal aging tests at 150 °C, 125 °C and 85 °C for 504 h (21 days). Activation energies were calculated based on the IMC layer thickness, temperature, and time. The activation energy required for the formation of IMCs was 45.5 KJ/mol for the plain epoxy solder, 52.8 KJ/mol for the 0.01%-GNS solder, 62.5 KJ/mol for the 0.05%-GNS solder, and 68.7 KJ/mol for the 0.1%-GNS solder. Thus, the preventive effects were higher for increasing concentrations of GNS in the epoxy solder. In addition, shear tests were employed on the solder joints to analyze the relationship between the addition of GNSs and the bonding characteristics of the solder joints. It was found that the addition of GNSs to epoxy solder weakened the bonding characteristics of the solder, but not critically so because the shear force was higher than for normal solder (i.e., without the addition of epoxy). Thus, the addition of a small amount of GNSs to epoxy solder can suppress the formation of an IMC layer during isothermal aging without significantly weakening the bonding characteristics of the epoxy solder paste.

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“…15 To address this drawback of Sn-Bi alloys, an alternative method is addition of epoxy to Sn-58 wt.%Bi solder. [16][17][18] In our previous studies, such epoxy-enhanced Sn-58 wt.%Bi solders with organic solderability preservative (OSP) surface finish were examined. The results of shear and drop tests showed that addition of epoxy enhanced the bonding strength of lowmelting-temperature/brittle Sn-58 wt.%Bi solder joints.…”

Section: Introductionmentioning

confidence: 99%

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Myung

Kim

et al. 2016

Journal of Elec Materi

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The influence of two kinds of surface finish, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the interfacial reactions and drop reliability of epoxy-enhanced Sn-58 wt.%Bi solder has been investigated after temperature-humidity storage tests. The chemical composition and morphology of intermetallic compounds (IMCs) were characterized by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and electron probe microanalysis. Also, the mechanical reliability of solder joints was evaluated using board-level drop tests. The Sn-Bi epoxy solder/ENEPIG joint exhibited higher IMC growth rate than the Sn-Bi epoxy solder/ENIG joint. After 500 h at 85°C/ 85% RH storage condition, new IMCs were formed on the Ni 3 Sn 4 layer in samples with both surface finishes. The results of board-level drop tests showed that the number of drops was higher for the ENIG than the ENEPIG surface finish. Solder joint fracture occurred along the interface between the solder and IMC layer for the ENIG surface finish. However, with the ENEPIG surface finish, the crack propagated between the IMCs.

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Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test

Cited by 8 publications

References 14 publications

Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures

Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures

Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

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